n-GaN
pillar photoanodes are fabricated by dry etching of a planar
GaN epilayer. The increased surface area results in a plateau photocurrent
enhancement of 84%. However, surface damage is introduced during dry
etching. In this work, the surface damage is controlled by the RF
chuck power. The GaN pillars fabricated using the lowest RF power
show a similar current onset potential and current–potential
slope as the planar GaN. In addition, the damaged GaN surface of the
pillars can be removed in NaOH solution, which leads to the plateau
current enhancement of 100% and the onset potential shifts −60
mV with respect to planar GaN. A pair of anodic and cathodic peaks
is found in the dark cyclic voltammogram of the damaged pillars, which
indicates the charging and discharging of the deep-level traps existing
at 0.6 eV below the CB edge.