“…Despite significant strides in the improvement of device performance, challenges still remain in the growth of high-quality metamorphic GaSb buffer layers on Si, which ultimately determines the device quality. Typical growth of III–V materials on Si involves mismatches in lattice constants, polarities, and thermal expansion coefficients, which lead to generations of threading dislocations (TDs), antiphase boundaries (APBs), and thermal cracks in the III–V layers, respectively. − First, the thermal cracking issue can mostly be avoided by constraining the total epitaxial III–V layer thickness below ∼5 μm. , Second, threading dislocation density (TDD) can be reduced by various defect filter layers (DFLs) such as the AlSb single insertion layer (SIL) and strained layer superlattices (SLSs). , Finally, APBs can be suppressed by using 4–6° off-cut Si wafers, but this approach is not desirable in the long term because such off-cut Si wafers are not compatible with standard Si photonics platforms, which require nominally on-axis (001) Si …”