2022
DOI: 10.1021/acsami.2c14492
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Enhanced Photoluminescence of 1.3 μm InAs Quantum Dots Grown on Ultrathin GaAs Buffer/Si Templates by Suppressing Interfacial Defect Emission

Abstract: We report on the photoluminescence enhancement of 1.3 μm InAs quantum dots (QDs) epitaxially grown on an ultrathin 250 nm GaAs buffer on a Si substrate. Decreasing the GaAs buffer thickness from 1000 to 250 nm was found to not only increase the coalesced QD density from 6.5 × 10 8 to 1.9 × 10 9 cm −2 but also decrease the QD photoluminescence emission intensity dramatically. Inserting an Al 0.4 Ga 0.6 As potential barrier layer maintained strong photoluminescence from the QDs by effectively suppressing carrier… Show more

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Cited by 9 publications
(8 citation statements)
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“…Electron channeling contrast images of (a) 3000 nm GaAs buffer, (b) 1500 nm GaAs buffer, and (c) 700 nm GaAs buffer on Si. (d) Recent TDD results of different research groups. , …”
Section: Resultsmentioning
confidence: 99%
“…Electron channeling contrast images of (a) 3000 nm GaAs buffer, (b) 1500 nm GaAs buffer, and (c) 700 nm GaAs buffer on Si. (d) Recent TDD results of different research groups. , …”
Section: Resultsmentioning
confidence: 99%
“…There have been a few studies on InP-based lasers emitting at 2 μm and beyond, but these low-bandgap QW lasers suffer from low gain and high-temperature sensitivity, limiting their practical use [ 9 , 10 ]. At the shorter O-band (1.3 μm), InAs quantum dots (QDs) grown on GaAs are established to be superior quantum emitters compared to their bulk and QW counterparts due to their 3D carrier confinement, Dirac delta-like density of states, and dislocation tolerance [ 11 , 12 ]. Quantum emitters at 2 μm would benefit greatly from the advantages of zero-dimensionality, but 2 μm is beyond the reach of the conventional InAs QDs on GaAs system.…”
Section: Introductionmentioning
confidence: 99%
“…Despite significant strides in the improvement of device performance, challenges still remain in the growth of high-quality metamorphic GaSb buffer layers on Si, which ultimately determines the device quality. Typical growth of III–V materials on Si involves mismatches in lattice constants, polarities, and thermal expansion coefficients, which lead to generations of threading dislocations (TDs), antiphase boundaries (APBs), and thermal cracks in the III–V layers, respectively. First, the thermal cracking issue can mostly be avoided by constraining the total epitaxial III–V layer thickness below ∼5 μm. , Second, threading dislocation density (TDD) can be reduced by various defect filter layers (DFLs) such as the AlSb single insertion layer (SIL) and strained layer superlattices (SLSs). , Finally, APBs can be suppressed by using 4–6° off-cut Si wafers, but this approach is not desirable in the long term because such off-cut Si wafers are not compatible with standard Si photonics platforms, which require nominally on-axis (001) Si …”
Section: Introductionmentioning
confidence: 99%