Enhanced strength and electrical conductivity in ultrafine-grained Cu-Cr alloy processed by severe plastic deformation

Исламгалиев, Р. К.; Нестеров, К. М.; Champion, Yannick; Valiev, Ruslan Z.

doi:10.1088/1757-899x/63/1/012118

Cited by 15 publications

(10 citation statements)

References 17 publications

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“…Therefore, it is necessary to explore the relationship between microstructural parameters and their properties. The strength of SPD-deformed materials can be further improved by alloying, as the solute atoms and precipitates have a pinning effect on dislocations and grain boundaries, as shown in previous studies [18][19][20][21][22].…”

Section: Introductionmentioning

confidence: 67%

The Influence of Severe Plastic Deformation and Subsequent Annealing on the Microstructure and Hardness of a Cu–Cr–Zr Alloy

et al. 2020

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A Cu–1.1%Cr–0.04%Zr (wt.%) alloy was processed by severe plastic deformation (SPD) using the equal channel angular pressing (ECAP) technique at room temperature (RT). It was found that when the number of passes increased from one to four, the dislocation density significantly increased by 35% while the crystallite size decreased by 32%. Subsequent rolling at RT did not influence considerably the crystallite size and dislocation density. At the same time, cryorolling at liquid nitrogen temperature yielded a much higher dislocation density. All the samples contained Cr particles with an average size of 1 µm. Both the size and fraction of the Cr particles did not change during the increase in ECAP passes and the application of rolling after ECAP. The hardness of the severely deformed Cu alloy samples can be well correlated to the dislocation density using the Taylor equation. Heat treatment at 430 °C for 30 min in air caused a significant reduction in the dislocation density for all the deformed samples, while the hardness considerably increased. This apparent contradiction can be explained by the solute oxygen hardening, but the annihilation of mobile dislocations during annealing may also contribute to hardening.

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Section: Introductionmentioning

confidence: 67%

The Influence of Severe Plastic Deformation and Subsequent Annealing on the Microstructure and Hardness of a Cu–Cr–Zr Alloy

et al. 2020

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“…Hence, studying effects of gradient straining on multiple properties of a material processed by HPT is quite attractive, and it is evident from increasing popularity of HPT in the last two decades. Herein, microstructure and various mechanical properties, such as hardness, fatigue, wear, etc., of various metals and alloys processed through HPT have been well studied; however, only a few reports have discussed the effect of HPT processing on electrical conductivity (or resistivity) of materials . It is particularly interesting that the ultrafine grains leading to high strength as per the Hall–Petch relation may also enhance the overall electron scattering at the grain boundaries of SPD‐processed metals.…”

Section: Introductionmentioning

confidence: 99%

Effect of High‐Pressure Torsion on Hardness and Electrical Resistivity of Commercially Pure Cu

et al. 2019

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Commercially pure Cu is processed through high‐pressure torsion (HPT) at 6 GPa up to 50 turns and stored under the ambient condition for 21 months. Subsequently, microhardness and electrical resistivity of the Cu samples are measured and correlated with the microstructure. Grain size monotonically decreases with the number of HPT turns and becomes saturated at ≈300 nm after an equivalent strain of ≈40. Considerable fractions of low‐angle grain and twin boundaries are observed in the samples processed through HPT to low strains; however, their fractions decrease with increasing HPT turns. Consistently, although the hardness of the processed samples is greater than that of the annealed coarse‐grained sample, it first decreases with HPT straining and subsequently increases to a saturated value of ≈160 HV. In contrast, the electrical resistivity of Cu first increases with HPT processing, then decreases and finally becomes saturated at a value of ≈22 nΩ m, which is slightly higher than the least value obtained in this study. The obtained results are compared with the literature on HPT processing of Cu, and the usefulness of the ambient ageing for optimizing the hardness‐conductivity relationship is discussed.

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“…In the literature, there is controversy about the effect of long solution annealing on the Cr dissolution in the Cu matrix of Cu-Cr-Zr alloys. Indeed, many authors [18,23,44,45] stated that Cu-Cr-Zr, after solution annealing in the range of 930-1 050 • C, becomes fully free from any precipitate or cluster. Other studies [12,43,46] evidenced the presence of Cr clusters caused by incomplete dissolution.…”

Section: Resultsmentioning

confidence: 99%

Cr cluster characterization in Cu-Cr-Zr alloy after ECAP processing and aging using SANS and HAADF-STEM

Abib¹,

Azzeddine²,

Alili³

et al. 2020

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The precipitation of nano-sized Cr clusters was investigated in a commercial Cu-1Cr-0.1Zr (wt.%) alloy processed by equal-channel angular pressing and subsequent aging at 550 • C for 4 h using Small-Angle Neutron Scattering (SANS) measurements and High-Angle Annular Dark-Field-Scanning Transmission Electron Microscopy (HAADF-STEM). The size and volume fraction of the nano-sized Cr clusters were estimated using both techniques. The parameter values assessed by SANS (d ∼ 3.2 nm, Fv ∼ 1.1 %) agreed reasonably with those by HAADF-STEM (d ∼ 2.5 nm, Fv ∼ 2.3 %). In addition to the nano-sized Cr clusters, HAADF-STEM indicated the presence of rare cuboid and spheroid sub-micronic Cr particles measuring approximately 380-620 nm in mean size. Both techniques did not evidence the presence of intermetallic CuxZry phases within the aging conditions.

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Enhanced strength and electrical conductivity in ultrafine-grained Cu-Cr alloy processed by severe plastic deformation

Cited by 15 publications

References 17 publications

The Influence of Severe Plastic Deformation and Subsequent Annealing on the Microstructure and Hardness of a Cu–Cr–Zr Alloy

The Influence of Severe Plastic Deformation and Subsequent Annealing on the Microstructure and Hardness of a Cu–Cr–Zr Alloy

Effect of High‐Pressure Torsion on Hardness and Electrical Resistivity of Commercially Pure Cu

Cr cluster characterization in Cu-Cr-Zr alloy after ECAP processing and aging using SANS and HAADF-STEM

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