2014
DOI: 10.1016/j.tsf.2014.06.005
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Enhanced surface coverage and conductivity of Cu complex ink-coated films by laser sintering

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Cited by 14 publications
(13 citation statements)
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“…Significant decrease in resistivity was achieved by further increasing the curing time to 30 min. After that, the resistivity decreases moderately and reaches 15 μΩ·cm at 60 min curing, which was approximately 10 times the resistivity of bulk silver and is comparable to other researchers [18][19][20]. Clearly, the formation of a low resistivity silver pattern at a mild curing temperature has been achieved by using the synthesized silver oxalate ink.…”
Section: Effects Of Post-heat Treatment On Microstructure and Resistisupporting
confidence: 81%
See 1 more Smart Citation
“…Significant decrease in resistivity was achieved by further increasing the curing time to 30 min. After that, the resistivity decreases moderately and reaches 15 μΩ·cm at 60 min curing, which was approximately 10 times the resistivity of bulk silver and is comparable to other researchers [18][19][20]. Clearly, the formation of a low resistivity silver pattern at a mild curing temperature has been achieved by using the synthesized silver oxalate ink.…”
Section: Effects Of Post-heat Treatment On Microstructure and Resistisupporting
confidence: 81%
“…The critical issue that needs to be addressed when inkjet printing is applied to these applications is ink development. Previously, conductive inks based on silver [6][7][8][9][10][11][12][13][14][15][16][17][18], copper [19], carbon [20], and conductive polymers [21] have been demonstrated, among which, silverbased ink has received great interests because of excellent conductivity and anti-oxidation properties of bulk silver. To date, two kinds of silver inks have been adopted for inkjet printing conductive patterns on substrates.…”
Section: Introductionmentioning
confidence: 99%
“…Subsequently, Lee et al published a morphological comparison of laser and thermal sintering of Cu films-while the laser sintered films were denser and thinner with a more uniform microstructure, the thermally sintered films exhibited better crystalline qualities which resulted in lower resistivities on PI substrates (1 = 1.70 10 À7 W m and 1.92 10 À7 W m for thermal and laser sintered films, respectively). [89] Pre-drying of the ink before sintering was found to be an essential step for both thermal and laser sintering. Interestingly, for both thermally sintered thinner and thicker films, films sintered at 150 8C (1 = 1.70 10 À7 W m) were more conductive than those at higher temperatures, with the authors attributing this abnormal behaviour to the internal morphology and surface coverage of the annealed films.…”
Section: Copper Mod Inksmentioning
confidence: 99%
“…They were pure N 2 environment experiment and showed longer sintering time such as about a half second. 17,18 However N 2 costs more than air environment and faster sintering time means higher productivity. In this paper, the Cu based MOD ink was sintered by laser in ambient air condition.…”
Section: -5mentioning
confidence: 99%