Memristor
devices that can operate at high speed with high density
and nonvolatile capabilities have great potential for the development
of high data storage and robust wearable devices. However, in real-time,
the performance of memristors is challenged by their instability toward
harsh working conditions such as high temperature, extreme humidity,
photo irradiation, and mechanical bending. Herein, we introduce a
TaO
x
/AlN-based flexible and transparent
memristor device having stable endurance under extreme 2 mm bending
(for more than 107 cycles) with an ON/OFF ratio of more
than 2 orders of magnitude at 25 ns rapid switching. This device exhibits
excellent flexibility under extreme bending conditions (bending radius
of 2 mm) even with intense ultraviolet (UV) radiation. A thin AlN
insertion layer having low dielectric and high thermal conductivity
plays a crucial role in improving the switching stability and device
flexibility. In particular, the devices exhibit excellent minimum
switching fluctuations under UV irradiation, >106 s
nonvolatility
retention at high temperature (135 °C), various gas ambient,
and damp heat test (humidity 95.5%, 83 °C) because of the indium
metal drift during the switching process and high bonding energy of
Ta–O. Most importantly, direct observation of indium metal
strongly anchored in the TaO
x
switching
layer during the switching process is reported for the first time
via transmission electron microscopy, which provides clear insights
into the switching phenomenon. Furthermore, the results of electrical
and material analyses explain that our facile device design has excellent
potential for wearable and aerospace applications.