2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2023
DOI: 10.1109/ipfa58228.2023.10249039
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Enhanced technique through pattern and power modulation with ELITE system for failure analysis on advance package technology

Wen Jye Ng,
Yong Khai Ooi,
Jou Ching Ng
et al.
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