Enhanced thermal conductive and mechanical properties of thermoresponsive polymeric composites: Influence of 3D interconnected boron nitride network supported by polyurethane@polydopamine skeleton
“…NFC has excellent mechanical properties and can enhance the MGP for excellent compressive recovery [ 35 ]. At the same time, the increase in NFC improves the hydrogen bond interaction, and the existence of hydrogen bonds further leads to increased strain [ 17 ]. Fig.…”
Section: Resultsmentioning
confidence: 99%
“…DA and PU sponges (1:1) were immersed into the mixture and slowly stirred for 24 h at 60 ℃. The PU covered by PDA (PU@PDA) was cleaned cyclically with ethanol and deionized water 3 times to eliminate self-polymerized DA and obtained by drying in the oven at 70 ℃ for 1 h [ 11 , 17 ].…”
Section: Methodsmentioning
confidence: 99%
“…When CNT is the incident surface of electromagnetic waves, the average SE T of the same composite is 29.5 dB, with an 8.8 dB difference. Jiang et al [ 17 ] coated boron nitride nanosheets on the PU sponges to construct a 3D interconnected network structure. After vacuum infiltration of the polymer matrix, the manufactured PBPP composites achieved a high thermal conductivity of 2.4 W m −1 K −1 at a loading of 17.5 wt%.…”
The multi-functionalization of polymer composites refers to the ability to connect multiple properties through simple structural design and simultaneously achieve multi-performance optimization. The large-scale design and mass production to realize the reasonable structure design of multifunctional polymer composites are urgently remaining challenges. Herein, the multifunctional MXene/graphene/polymer composites with three-dimensional thermally and electrically conductive network structures are fabricated via the utilization of the microstructure of the soft template, and a facile dispersion dip-coating approach. As a result, the polymer composites have a multi-performance improvement. At the MXene and graphene content of 18.7 wt%, the superior through-plane thermal conductivity of polymer composite is 2.44 W m−1 K−1, which is 1118% higher than that of the polymer matrix. The electromagnetic interference (EMI) shielding effectiveness of the sample reaches 43.3 dB in the range of X-band. And the mechanical property of the sample has advanced 4 times compared with the polymer matrix. The excellent EMI shielding and thermal management performance, along with the effortless and easy-to-scalable producing techniques, imply promising perspectives of the polymer composites in the next-generation smart electronic devices.
“…NFC has excellent mechanical properties and can enhance the MGP for excellent compressive recovery [ 35 ]. At the same time, the increase in NFC improves the hydrogen bond interaction, and the existence of hydrogen bonds further leads to increased strain [ 17 ]. Fig.…”
Section: Resultsmentioning
confidence: 99%
“…DA and PU sponges (1:1) were immersed into the mixture and slowly stirred for 24 h at 60 ℃. The PU covered by PDA (PU@PDA) was cleaned cyclically with ethanol and deionized water 3 times to eliminate self-polymerized DA and obtained by drying in the oven at 70 ℃ for 1 h [ 11 , 17 ].…”
Section: Methodsmentioning
confidence: 99%
“…When CNT is the incident surface of electromagnetic waves, the average SE T of the same composite is 29.5 dB, with an 8.8 dB difference. Jiang et al [ 17 ] coated boron nitride nanosheets on the PU sponges to construct a 3D interconnected network structure. After vacuum infiltration of the polymer matrix, the manufactured PBPP composites achieved a high thermal conductivity of 2.4 W m −1 K −1 at a loading of 17.5 wt%.…”
The multi-functionalization of polymer composites refers to the ability to connect multiple properties through simple structural design and simultaneously achieve multi-performance optimization. The large-scale design and mass production to realize the reasonable structure design of multifunctional polymer composites are urgently remaining challenges. Herein, the multifunctional MXene/graphene/polymer composites with three-dimensional thermally and electrically conductive network structures are fabricated via the utilization of the microstructure of the soft template, and a facile dispersion dip-coating approach. As a result, the polymer composites have a multi-performance improvement. At the MXene and graphene content of 18.7 wt%, the superior through-plane thermal conductivity of polymer composite is 2.44 W m−1 K−1, which is 1118% higher than that of the polymer matrix. The electromagnetic interference (EMI) shielding effectiveness of the sample reaches 43.3 dB in the range of X-band. And the mechanical property of the sample has advanced 4 times compared with the polymer matrix. The excellent EMI shielding and thermal management performance, along with the effortless and easy-to-scalable producing techniques, imply promising perspectives of the polymer composites in the next-generation smart electronic devices.
“…Polyimide (PI) films process excellent electrically insulating, mechanical, heat resistance, and radiation resistance properties, having been widely used in high-precision intelligent control systems, 5G communication terminals, and base stations. − However, the intrinsic thermal conductivity coefficient (λ) of most PI films are low, − which cannot meet the heat dissipation requirements of high-power electronic and electrical equipment at present and in the future. − …”
The low thermal conductivity coefficient
(λ) of polyimide
(PI) films are limiting their application in high-power electronic
equipment, and the disordered alignment of fillers discourage efficient
improvement of λ for PI-based composite films. Herein, polyethylene
glycol trimethylnonyl ether is used to perform liquid crystalline
modification on graphene fluoride (LC-GeF) to achieve ordered alignment.
Intrinsically thermally conductive liquid crystalline PI (LC-PI) matrix
is utilized to fabricate thermally conductive LC-GeF/LC-PI composite
films. In-plane λ (λ∥) and through-plane
λ (λ⊥) of 15 wt % LC-GeF/LC-PI composite
films reach 4.21 and 0.63 W/(m·K), 446.8% and 320.0% higher than
λ∥ (0.77 W/(m·K)) and λ⊥ (0.15 W/(m·K)) of normal PI films, 99.5% and 96.9% higher than
λ∥ (2.11 W/(m·K)) and λ⊥ (0.32 W/(m·K)) of LC-PI films, also higher than 15 wt % GeF/LC-PI
composite films. Additionally, LC-GeF/LC-PI composite films possess
more excellent insulating, mechanical, and thermal properties than
GeF/LC-PI composite films.
“…Researchers are still making efforts to achieve better electrical-mechanical performance of conductive polymer composite materials (CPCs) for various engineering applications [1][2][3]. Other properties of these composites that are also of interest are their thermal conductivity, thermal stability, corrosion resistance, and the lightweight nature of the composites [4][5][6]. Improvement of the electrical properties of CPCs can be achieved by using conductive fillers such as graphite (G), carbon black (CB), carbon nanotubes (CNTs), graphene nanoplatelets (GNPs), and carbon fibers (CF) [7][8][9][10][11].…”
This study aims to improve the electrical-mechanical performance of traditional epoxy/graphite composites for engineering applications. The improvement in the properties of these composites depended on the incorporation of different sizes of graphite particles of the same type and controlling their curing process conditions. The thermal properties and microstructural changes were also characterized. A maximum in-plane electrical conductivity value of approximately 23 S/cm was reported for composites containing 80 wt.% G with a particle size of 150 µm. The effect of combining large and small G particles increased this value to approximately 32 S/cm by replacing the large particle size with 10 wt.% smaller particles (75 µm). A further increase in the electrical conductivity to approximately 50 S/cm was achieved due to the increase in curing temperature and time. Increasing the curing temperature or time also had a crucial role in improving the tensile strength of the composites and a tensile strength of ~19 MPa was reported using a system of multiple filler particle sizes processed at the highest curing temperature and time compared to ~9 MPa for epoxy/G150 at 80 wt.%. TGA analysis showed that the composites are thermally stable, and stability was improved by the addition of filler to the resin. A slight difference in the degraded weights and the glass transition temperatures between composites of different multiple filler particle sizes was also observed from the TGA and DSC results.
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