2024 IEEE 7th International Electrical and Energy Conference (CIEEC) 2024
DOI: 10.1109/cieec60922.2024.10583197
|View full text |Cite
|
Sign up to set email alerts
|

Enhanced Thermal Conductivity and Insulation Properties of Mica Tape with BN-Coated Meyer Bar Technology

Yu Feng,
Yiming Song,
Dong Yue
et al.
Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 22 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?