Enhanced thermal conductivity and rheological performance of epoxy and liquid crystal epoxy composites with filled Al2O3 compound

Tian, Fang; Cao, Jinmei; Ma, Wenqi

doi:10.1016/j.polymertesting.2023.107940

Cited by 14 publications

(4 citation statements)

References 24 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The Al 2 O 3 content of 80 wt% of the resin increases the thermal conductivity of the composite to 1.86 W/m*K, and also slightly enhances the thermal stability of the hardened liquid crystal [81]. According to the article by Tian et al [82] the composite containing Al 2 O 3 is characterized by a significantly reduced viscosity compared to the pure polymer and also affects the morphology of the entire mixture, increasing the order of the liquid crystal networks on a micro-scale. There are also studies combining BN and Al 2 O 3 particles to create a hybrid nanofiller.…”

Section: Inorganic Fillersmentioning

confidence: 99%

Advancements in The Cross-Linking and Morphology of Liquid Crystals

Zając,

Kisiel,

Mossety-Leszczak

2024

Crystals

View full text Add to dashboard Cite

The liquid crystal state (LC) in polymer chemistry is a topic discussed in varied materials research. The anisotropic properties typical of these compounds are mostly the result of the presence of mesogens in the structure of liquid crystals. This article traces the development of liquid crystal science, focusing on liquid crystal epoxy resins (LCERs) and emphasizing the crucial role of mesogens and their diverse effect on the materials. It also highlights the importance of understanding the morphology of LC polymers, explaining their profound impact on material properties and performance. It explores the cross-linking process of liquid crystal resins and composites, describing how changes in structural factors affect material structure. The article also provides information about hardeners and their influence on the cross-linked structure. Various nanofillers were also discussed, elucidating their impact on the resulting composites.

show abstract

Section: Inorganic Fillersmentioning

confidence: 99%

Advancements in The Cross-Linking and Morphology of Liquid Crystals

Zając,

Kisiel,

Mossety-Leszczak

2024

Crystals

View full text Add to dashboard Cite

show abstract

“…Other investigations also reported the similar results. [116][117][118] Tian et al [116] reported the synergistic effect between alumina particles and LCE in concurrently boosting the k and electrical resistivity of composites. Li team [117] fabricated the f-BNNS/LCE composites displaying high k compared the composites with a E-51 as the matrix thanks to the synergistic effect in constructing heat conductive pathways for fast phonon transport between f-BNNS and LCE.…”

Section: High-k Lce Compositesmentioning

confidence: 99%

Advances in Liquid Crystal Epoxy: Molecular Structures, Thermal Conductivity, and Promising Applications in Thermal Management

Zhou,

Wang,

Kong

et al. 2024

Energy & Environ Materials

View full text Add to dashboard Cite

Traditional heat conductive epoxy composites often fall short in meeting the escalating heat dissipation demands of large‐power, high‐frequency, and high‐voltage insulating packaging applications, due to the challenge of achieving high thermal conductivity (k), desirable dielectric performance, and robust thermomechanical properties simultaneously. Liquid crystal epoxy (LCE) emerges as a unique epoxy, exhibiting inherently high k achieved through the self‐assembly of mesogenic units into ordered structures. This characteristic enables liquid crystal epoxy to retain all the beneficial physical properties of pristine epoxy, while demonstrating a prominently enhanced k. As such, liquid crystal epoxy materials represent a promising solution for thermal management, with potential to tackle the critical issues and technical bottlenecks impeding the increasing miniaturization of microelectronic devices and electrical equipment. This article provides a comprehensive review on recent advances in liquid crystal epoxy, emphasizing the correlation between liquid crystal epoxy's microscopic arrangement, organized mesoscopic domain, k, and relevant physical properties. The impacts of LC units and curing agents on the development of ordered structure are discussed, alongside the consequent effects on the k, dielectric, thermal, and other properties. External processing factors such as temperature and pressure and their influence on the formation and organization of structured domains are also evaluated. Finally, potential applications that could benefit from the emergence of liquid crystal epoxy are reviewed.

show abstract

“…Therefore, epoxy resins are also used as encapsulation materials and printed circuit boards; however, general-purpose epoxy resins are known to have lower thermal conductivity than metallic and ceramic materials. In general, inorganic filler powders, such as alumina (Al 2 O 3 ) [2][3][4] and boron nitride (BN) [5][6][7][8][9][10][11][12], are added to the resin matrix to attain encapsulating materials with high thermal conductivity. However, the extent to which composite fillers can improve thermal conductivity is limited because the increase in filler content causes matrix embrittlement and deterioration of molding processability because of high viscosity.…”

Section: Introductionmentioning

confidence: 99%

Thermal Conductivity and Orientation Structure of Liquid Crystalline Epoxy Thermosets Prepared by Latent Curing Catalyst

Harada,

Matsumoto

2023

Crystals

View full text Add to dashboard Cite

Improvements in the performance of electronic devices necessitate the development of polymer materials with heat dissipation properties. Liquid crystalline (LC) epoxies have attracted attention because of the orientation of their polymer network chains and their resultant high thermal conductivity. In this study, a diglycidyl ether of 1-methyl-3-(4-phenylcyclohex-1-enyl)benzene was successfully synthesized as an LC epoxy and the LC temperature range was evaluated via differential scanning calorimeter (DSC). The synthesized LC epoxy was cured with m-phenylenediamine (m-PDA) as an amine-type curing agent and 1-(2-cyanoethyl)-2-undecylimidazole (CEUI) as a latent curing catalyst, respectively. The LC phase structure and domain size of the resultant epoxy thermosets were analyzed through X-ray diffraction (XRD) and polarized optical microscopy (POM). High thermal conductivity was observed in the m-PDA system (0.31 W/(m·K)) compared to the CEUI system (0.27 W/(m·K)). On the other hand, in composites loaded with 55 vol% Al2O3 particles as a thermal conductive filler, the CEUI composites showed a higher thermal conductivity value of 2.47 W/(m·K) than the m-PDA composites (1.70 W/(m·K)). This difference was attributed to the LC orientation of the epoxy matrix, induced by the hydroxyl groups on the alumina surface and the latent curing reaction.

show abstract

Enhanced thermal conductivity and rheological performance of epoxy and liquid crystal epoxy composites with filled Al2O3 compound

Cited by 14 publications

References 24 publications

Advancements in The Cross-Linking and Morphology of Liquid Crystals

Advancements in The Cross-Linking and Morphology of Liquid Crystals

Advances in Liquid Crystal Epoxy: Molecular Structures, Thermal Conductivity, and Promising Applications in Thermal Management

Thermal Conductivity and Orientation Structure of Liquid Crystalline Epoxy Thermosets Prepared by Latent Curing Catalyst

Contact Info

Product

Resources

About