Enhanced thermal conductivity and tensile strength of Al–17Si–3.5Cu with SiC-nanoparticle addition

Jiang, Dapeng; Yu, Jinjiang

doi:10.1039/c9ra07253e

Cited by 5 publications

(2 citation statements)

References 39 publications

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“…Therefore, the preparation of high thermal conductivity polymer composites has become an urgent problem. 3 , 4 Generally speaking, polymers are mixed with thermally conductive fillers to improve the thermal conductivity of polymer materials, 2 , 5 such as metal filler (Ag, 6 − 8 Cu, 9 − 11 Au 12 ), ceramic filler (MgO, 13 , 14 Al 2 O 3 , 15 − 17 BN, 18 − 20 AlN, 21 , 22 SiC, 20 , 23 , 24 SiO 2 25 − 28 ), and carbon material (carbon fiber, 17 , 29 , 30 carbon black, 31 − 34 graphene, 35 , 36 single-wall/multi-wall, 37 − 40 and graphite 39 , 41 − 43 ). However, ceramic fillers and metal fillers generally have high density, and it is difficult to achieve high thermal conductivity with low filler content.…”

Section: Introductionmentioning

confidence: 99%

“…Polymer composites are widely used in aerospace, automotive, construction, electronic components, and other fields due to their excellent mechanical properties and corrosion resistance. , However, low thermal conductivity limits their applications; they must be modified to obtain high thermal conductivity. Therefore, the preparation of high thermal conductivity polymer composites has become an urgent problem. , Generally speaking, polymers are mixed with thermally conductive fillers to improve the thermal conductivity of polymer materials, , such as metal filler (Ag, − Cu, − Au), ceramic filler (MgO, , Al 2 O 3 , − BN, − AlN, , SiC, ,, SiO 2 − ), and carbon material (carbon fiber, ,, carbon black, − graphene, , single-wall/multi-wall, − and graphite ,− ). However, ceramic fillers and metal fillers generally have high density, and it is difficult to achieve high thermal conductivity with low filler content.…”

Section: Introductionmentioning

confidence: 99%

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Carbon Fiber/Phenolic Composites with High Thermal Conductivity Reinforced by a Three-Dimensional Carbon Fiber Felt Network Structure

et al. 2022

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The formation of highly thermally conductive composites with a three-dimensional (3D) oriented structure has become an important means to solve the heat dissipation problem of electronic components. In this paper, a carbon fiber (CF) felt with a 3D network structure was constructed through the airflow netting forming technology and needle punching. The carbon fiber/phenolic composites were then fabricated by CF felt and phenolic resin through vacuum impregnation and compression molding. The effects of CF felt content and porosity on the thermal conductivity of carbon fiber/phenolic composites were investigated. The enhancement of carbon skeleton content promotes the conduction of heat inside the composites, and the decrease of porosity also significantly improves the thermal conductivity of the composites. The results indicate that the composites exhibit a maximum in-plane thermal conductivity of 1.3 W/mK, which is about 650% that of pure phenolic resin, showing that the construction of 3D thermal network structure is conducive to the reinforcement of thermal conductivity of composites. The method can provide a certain theoretical basis for constructing a thermally conductive composite with a three-dimensional structure.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Carbon Fiber/Phenolic Composites with High Thermal Conductivity Reinforced by a Three-Dimensional Carbon Fiber Felt Network Structure

et al. 2022

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Dielectric thermally conductive boron nitride/silica@MWCNTs/polyvinylidene fluoride composites via a combined electrospinning and hot press method

Wu,

Gao,

Wang

et al. 2024

J Mater Sci: Mater Electron

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With the development of microelectronics towards integration, miniaturization and high power, the accumulation of heat in this small space has become a serious problem. Therefore, polymer matrix composites with high thermal conductivity and electrical insulation need to be developed urgently. Here, an ordered oriented boron nitride/silicon dioxide (silica) coated multiwalled carbon nanotubes (BN/SiO2@MWCNTs) thermally conductive network was constructed in a polyvinylidene fluoride (PVDF) matrix by electrostatic spinning technique, and subsequently the PVDF composites were prepared by hot-pressing. The synergistic effect of two-dimensional BN and one-dimensional MWCNTs in PVDF was investigated. It was found that the out-of-plane thermal conductivity of BN30/SiO2@MWCNTs composites reached 0.4693 Wm−1 K−1, which was 209% higher than that of pure PVDF and 10% higher than that of BN/PVDF composites. The in-plane thermal conductivity of BN30/SiO2@MWCNts) composites reached 1.5642 Wm−1 K−1, which was 1055% higher than pure PVDF and 40% higher than BN/PVDF composites. This is attributed to the synergistic effect of BN on SiO2@MWCNTs. Meanwhile, the volume resistivity and breakdown strength of the BN/SiO2@MWCNTs/PVDF composites reached 3.6 × 1013 Ω m and 47.68 kV/mm, respectively. The results indicate that the BN30/SiO2@MWCNTs/PVDF composites have excellent thermal conductivity and electrical insulating properties, which are promising for microelectronics applications.

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In situ formation of SiC in Al–40Si alloy during high-pressure solidification

Zhang

Zou

Wei

et al. 2021

Ceramics International

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Enhanced thermal conductivity and tensile strength of Al–17Si–3.5Cu with SiC-nanoparticle addition

Abstract: An interfacial nanocomposite layer was proposed to investigate the effect of SiCnps on interfacial thermal resistance between Si and Al.

Cited by 5 publications

References 39 publications

Carbon Fiber/Phenolic Composites with High Thermal Conductivity Reinforced by a Three-Dimensional Carbon Fiber Felt Network Structure

Carbon Fiber/Phenolic Composites with High Thermal Conductivity Reinforced by a Three-Dimensional Carbon Fiber Felt Network Structure

Dielectric thermally conductive boron nitride/silica@MWCNTs/polyvinylidene fluoride composites via a combined electrospinning and hot press method

In situ formation of SiC in Al–40Si alloy during high-pressure solidification

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