2009
DOI: 10.1016/j.apenergy.2008.10.020
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Enhanced thermal conductivity and thermal performance of form-stable composite phase change materials by using β-Aluminum nitride

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Cited by 264 publications
(91 citation statements)
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“…The experimental results obtained by differential scanning calorimetry demonstrated that the fabrication of the shape-stabilized phase change material of SA/ TAMSN could prevent stearic acid from leaking during the phase change process. However, the adsorption of stearic acid in the TAMSNs inhibits the activity of the stearic acid molecules, 18,37,38 and the enthalpy of SA/TAMSN would suffer a massive reduction. Additionally, with the increase of the content of stearic acid in the composite phase change material, the enthalpy of the SA/TAMSN would increase gradually.…”
Section: -33mentioning
confidence: 99%
“…The experimental results obtained by differential scanning calorimetry demonstrated that the fabrication of the shape-stabilized phase change material of SA/ TAMSN could prevent stearic acid from leaking during the phase change process. However, the adsorption of stearic acid in the TAMSNs inhibits the activity of the stearic acid molecules, 18,37,38 and the enthalpy of SA/TAMSN would suffer a massive reduction. Additionally, with the increase of the content of stearic acid in the composite phase change material, the enthalpy of the SA/TAMSN would increase gradually.…”
Section: -33mentioning
confidence: 99%
“…PCMs have the ability to change their state with a certain temperature range and can store and release large amounts of energy during phase change process [1][2][3]. Therefore, there are several studies on thermal properties and energy storage performance of a large number of pure and composite compounds including salt hydrates, paraffin wax and non-paraffin organic have been investigated as PCM [4][5][6][7][8][9]. Recently, microencapsulated PCM (microPCMs) technique has been developed to enlarge the utility fields of the PCMs.…”
Section: Introductionmentioning
confidence: 99%
“…As the thermal conductivity of epoxy systems is very low (about 0.2 W/(m!K)), thermally conductive fillers are added to these composites in order to dissipate the heat generated in electronic devices [6]. Various kinds of fillers, such as metals and metal oxides [7,8], aluminum nitride (AlN) [9][10][11], boron nitride (BN) [12], and silicon carbide (SiC) [13] have been applied to prepare thermally conductive polymer composites. Among them, AlN is a nontoxic, low cost substance, readily available as high purity powder.…”
Section: Introductionmentioning
confidence: 99%