Enhanced thermal conductivity of polyarylene ether nitrile composites blending hexagonal boron nitride

Zhu, Ying; Luo, Yumeng; Tang, Xiran; Tong, Lifen; Liu, Xiaobo

doi:10.1002/app.53597

Cited by 6 publications

(4 citation statements)

References 30 publications

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“…For most polymeric composites, its high TC is owned by high loadings of fillers, 57 hybrid fillers, and synergistic loadings and types [58][59][60] as shown in Figure 6E. Compared to the previously reported PENbased composites, [44][45][46]61,62 PEN/BCB/BNNS composites in this work possess a relatively high TC even at a very low filler addition (5 vol%) combined with the crystals or cross-linked networks. As a result, these composites exhibit great potential in thermal conductive applications.…”

Section: Thermal Performance Of Pen/bcb/ Bnns Composite Filmsmentioning

confidence: 62%

“…K. 45 In addition, Zhu et al successfully created PEN/h-BN composite films with a TC of only 0.54 W/m.K when the addition amount reached 30 wt%. 46 However, all previous work suffered from disadvantages such as detrimental impact on mechanical properties and incomplete formation of thermal conduction pathways at high loadings. Furthermore, the composite viscosity increased, affecting processability.…”

Section: Introductionmentioning

confidence: 99%

“…Wei et al prepared BN@SPEN/PEN composites with different filler loadings, and the TC values can be as high as 0.69 W/m.K 45 . In addition, Zhu et al successfully created PEN/h‐BN composite films with a TC of only 0.54 W/m.K when the addition amount reached 30 wt% 46 . However, all previous work suffered from disadvantages such as detrimental impact on mechanical properties and incomplete formation of thermal conduction pathways at high loadings.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

He,

Zhang,

Liu

et al. 2023

Polymer Composites

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Thermal conductive polymer‐based composites synchronously with stable dielectric and excellent mechanical properties are urgently needed for high‐temperature‐resistant electronic devices. Here, a significant improvement in the thermal conductivity (TC), thermal stability, dielectric, and mechanical performance was simultaneously achieved in the polyarylene ether nitrile (PEN)/divinyl siloxane‐bisbenzocyclobutene (BCB) matrix through the incorporation of boron nitride nanosheets (BNNS) combined together with the post‐solid phase chemical reaction technique. The significant increase in the effective filler‐filler and filler‐crystal contacts in the composites was the main reason for the improvement in TC and dielectric constant. Besides, glass transition temperature (Tg) and mechanicals were enhanced in the presence of cross‐linked networks. By synchronously adding 15 vol% BNNS, the TC of composites after treatment reached up to 5.582 W/m.K, enhanced by 4.4 times higher than untreated. The dielectric constant was down to 2.93 at 1 MHz and the loss remained at a relatively low level. Meanwhile, the composite showed significantly enhanced thermal stability, mechanicals, and hydrophobicity (Tg = 336°C, T5% = 529°C, tensile strength and modulus was 94.5 MPa and 5.3 GPa, respectively, the contact angle was 101.76°). Thus, it promotes an effective strategy for fabricating a high‐performance‐polymer composite, which has the potential used in electronic materials.Highlights Crystallization‐crosslinking strategy optimizes overall performance. Crystals fill gaps between BNNS layers and connect thermal conductive pathway. Crosslinked networks limit molecular chain motion to reduce phonon scattering. The highest TC of the PEN/BCB/BNNS composite is up to 7.451 W/m.K. Thermal property shows significant improvement after crosslinking especially Tg.

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Section: Thermal Performance Of Pen/bcb/ Bnns Composite Filmsmentioning

confidence: 62%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

He,

Zhang,

Liu

et al. 2023

Polymer Composites

Self Cite

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show abstract

“…To improve the TC of polymeric materials, high thermal conductivity fillers (such as ceramic fillers, metal-based fillers, and carbon-based fillers) are generally added to the polymer to obtain thermal conductivity polymer-based composites. − Among them, the BN filler has received increasing attention because of its high TC and excellent mechanical and dielectric properties. − Liu et al developed different exfoliation methods to obtain BN nanosheets (BNNSs) and found that the incorporation of BNNSs into polymers can improve their thermal dissipation and mechanical and thermal stability. − Liu et al prepared polyarylene ether nitrile (PEN)/h-BN composite films by solution casting. The through-plane thermal conductivity of PEN/h-BN composites was 0.544 W/(m·K) at 30 wt % filler loading, which is 22.89% higher than that of pure PEN.…”

Section: Introductionmentioning

confidence: 99%

Designing Interfacial Reaction for BN@Si/Poly(phenylene oxide) Composites with Simultaneous Improved Thermal Conductivity and Dielectric Properties

Liu,

Liao,

Ruan

et al. 2023

ACS Appl. Polym. Mater.

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With the soaring development of device integration, miniaturization, and high frequency, electric devices have put forward synchronous and urgent requirements for thermal management composites with insulation, high thermal conductivity (TC), and low dielectric properties. However, due to phonon scattering and interfacial polarization, these performance requirements are difficult to meet simultaneously. In this work, based on the principles of interfacial engineering, hexagonal boron nitride (BN) was functionalized with methylvinyldimethoxysilane (MVDMS), and poly(phenylene oxide) (PPO) was modified by methacrylic anhydride. Owing to the introduction of reactive groups, the reaction between modified BN (BN@Si) and modified PPO (MPPO) in the mixing process enhances the interfacial forces, improves filler dispersions, and helps to reduce phonon scattering and interfacial polarization. The resulting polymer composites have a high TC of 5.21 W/(m K) at 70 wt % filler loading, 20.7 times than that of the pure MPPO resin, low dielectric loss of 0.00252, and high thermal stability. It is shown that interfacial regulation is crucial for BN@Si/poly(phenylene oxide) composites. The obtained composites hold great potential as thermal management materials for 5G electronic devices.

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Aqueous solution‐assisted in‐situ polymerization for fabrication of BNNS/PA12T nanocomposites with excellent thermal conductivity and mechanical properties

Li,

Liu,

et al. 2024

Polymer Composites

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Maintaining uniform dispersion of nano filler under high content is critical for fabricating polymer‐based composites with great mechanical and thermally conductive properties. In this work, BNNS/PA12T nanocomposite with the highest boron nitride nanosheet (BNNS) content of 23.1 wt% was successfully prepared by the aqueous solution‐assisted in‐situ polymerization method. Results demonstrate that the BNNS can be uniformly dispersed in the composite due to the low viscosity during the polymerization process. As a result, when the content of BNNS is 23.1 wt%, the mechanical properties and thermal conductivity of BNNS/PA12T nanocomposite are 62 MPa and 1.55 W/(m·K). Furthermore, the composites also possess excellent high‐temperature resistance with the coefficient of thermal expansion (CTE) of 60 ppm/°C, about one third of pure PA12T, and the thermal deformation temperature also reaches 139.4°C. Therefore, the fabricated BNNS/PA12T nanocomposite can be effectively applied as thermal management and packaging materials for electronic devices.Highlights BNNS/PA12T nanocomposites were prepared by aqueous solution‐assisted method. BNNS can be uniformly dispersed at the filling content up to 23 wt%. The thermal conductivity of BNNS/PA12T nanocomposite can reach 1.55 W/(m·K). Possessing excellent mechanical properties and dimensional stability. The nanocomposite can be effectively applied for thermal management.

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Enhanced thermal conductivity of polyarylene ether nitrile composites blending hexagonal boron nitride

Cited by 6 publications

References 30 publications

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

Designing Interfacial Reaction for BN@Si/Poly(phenylene oxide) Composites with Simultaneous Improved Thermal Conductivity and Dielectric Properties

Aqueous solution‐assisted in‐situ polymerization for fabrication of BNNS/PA12T nanocomposites with excellent thermal conductivity and mechanical properties

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