Enhanced Thermal Management in Microelectronics Packaging With 2D h‐BN Nanocomposite Underfills
Sara A. Razgaleh,
Shyam Aravamudhan
Abstract:The quest for faster and more densely packed microelectronic circuits has necessitated significant advancements in thermal management and encapsulant manufacturing technologies. This pursuit has driven the development of innovative methods to enhance heat flux and thermal transfer in microelectronics packaging. A critical issue is the thermal stress induced by the coefficient of thermal expansion (CTE) mismatch between the chip and the substrate, threatening the chip's mechanical integrity and lifespan. To add… Show more
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