Enhanced thermal properties of epoxy composites by constructing thermal conduction networks with low content of three-dimensional graphene

Abstract

Micro/nano electronic devices heat dissipation depends heavily on the thermal interface materials (TIMs). Despite notable progress, it is hard to efficaciously enhance the thermal properties of the hybrid TIMs with high-load additives due to an absence of effective heat transfer routes. Herein, the low content of 3D graphene with interconnected networks is adopted as the additive to improve the thermal properties of epoxy composite TIMs. The thermal diffusivity and thermal conductivity of the as-prepared hybrids were dramatically improved by constructing thermal conduction networks after adding 3D graphene as fillers. The 3D graphene/epoxy hybrid's optimal thermal characteristics were observed at 1.5 wt% of 3D graphene content, corresponding to a maximum enhancement of 683%. Besides, heat transfer experiments were further performed to determine the superb heat dissipation potential of the 3D graphene/epoxy hybrids. Moreover, the 3D graphene/epoxy composite TIM was also applied to high-power LED to improve heat dissipation. It effectively reduced the maximum temperature from 79.8 °C to 74.3 °C. These results are beneficial for the better cooling performance of electronic devices and provide useful guidelines for advancing the next-generation TIMs.

In situ exfoliation and surface functionalization of graphene oxide for epoxy composites with improved thermal and mechanical properties

“…The main restrictions that limit its potential applications are its low thermal resistance and brittle nature. 4 To produce composites with superior properties and meet the growing needs of industrial production, various types of modifying agents were used to improve their mechanical and thermal resistance. Nanofillers in the form of rods, spheres, or sheets have large specific surface area and can significantly affect the macroscopic properties of epoxy nanocomposites.…”

“…In industry, epoxy resin is widely used for a variety of purposes, such as structural adhesives, coatings, composites, and other structural materials owing to its good adhesion, mechanical properties, chemical stability, electrical insulation, low shrinkage, 1–3 etc. The main restrictions that limit its potential applications are its low thermal resistance and brittle nature 4 . To produce composites with superior properties and meet the growing needs of industrial production, various types of modifying agents were used to improve their mechanical and thermal resistance.…”