Enhanced through-plane thermal conductivity of boron nitride/epoxy composites

Yu, Cuiping; Zhang, Jun; Li, Zhuo; Tian, Wei; Wang, Liangjie; Luo, Jun; Li, Qiulong; Fan, Xiaodong; Yao, Yagang

doi:10.1016/j.compositesa.2017.03.012

Cited by 279 publications

(106 citation statements)

References 43 publications

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“…Approving dielectric and insulation properties are of critical significance for electronic packaging material . For instance, low dielectric constant of material is beneficial to reduce attenuation and accelerate transmission speed of electronic signal .…”

Section: Resultsmentioning

confidence: 99%

Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

Duan

Wang

et al. 2019

Macro Materials & Eng

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Dielectric polymer‐based composites with high breakdown strengths and thermal conductivities have attracted considerable attention when applied in electronic devices. In this study, a novel poly(m‐phenyleneisophthalamide) (PMIA) dielectric nanocomposite is successfully fabricated by introducing functionalized hexagonal boron nitride nanosheet (fBNNS) fillers. Due to effective functionalization of hexagonal boron nitride nanosheets (BNNSs), fBNNSs fillers are homogeneously dispersed in the PMIA matrix. The breakdown strength and thermal conductivity of PMIA/fBNNSs dielectric nanocomposite are investigated. Research results indicate that the breakdown strength of fBNNSs‐12 reaches 105.6 MV m−1, which is 1.34 times that of pure PMIA. Moreover, owing to high thermal conductivity of fBNNSs, the thermal conductivities of fBNNSs‐12 are observably increased to 8.06 W m−1 K of in‐plane direction and 0.84 W m−1 K of through‐plane direction, respectively. Considering these properties, the manufactured PMIA/fBNNSs dielectric nanocomposites show potential applications in field of electronics.

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Section: Resultsmentioning

confidence: 99%

Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

Duan

Wang

et al. 2019

Macro Materials & Eng

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“…This could be ascribed to the gravity force brought about by vacuum ltration, which tended to horizontally orient the hBN microplatelets. 12,32,33 However, the size of the hBN paper under vacuum ltration was limited by the size of the funnel, making it difficult to produce larger sizes. Therefore, it is still challenging to design and obtain hBN-lled composite lms at a large range of ller loadings via a facile and effective process in an oriented fashion.…”

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confidence: 99%

Hot pressing-induced alignment of hexagonal boron nitride in SEBS elastomer for superior thermally conductive composites

Gong

Zhang

et al. 2018

RSC Adv.

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Styrene-ethylene-butylene-styrene (SEBS) composite films containing well-dispersed and highly aligned hexagonal boron nitride (hBN) platelets were achieved by a ball milling process followed by hot-pressing treatment. An ultrahigh in-plane thermal conductivity of 45 W m À1 K À1 was achievable in the SEBS composite film with 95 wt% hBN. The corresponding out-of-plane thermal conductivity was also as high. The hBN/SEBS composite film was further used to cool a CPU connected to a computer, resulting in a decrease by about 4 C in the stable temperature. Percolation thresholds over 40 wt% and 60 wt% in the hBN/SEBS composites were obtained in the in-plane and out-of-plane directions, respectively. This phenomenon has rarely been reported in polymer composites. Molecular dynamics simulations were also conducted to support this percolation threshold. The linear coefficients of the thermal expansion value of the hBN/SEBS composite with 95 wt% hBN was as low as 16 ppm K À1.This was a significant decrease compared to that of pure SEBS (149 ppm K À1). The proposed strategy provides valuable advice about the heat-transfer mechanism in polymer composites containing oriented two-dimensional materials.

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“…For hexagonal and cubic BN forms, the bulk Young's moduli typically are of the order of 35 and 400 GPa, respectively [33]. BN particles have been used in the preparation of thermally conductive composites as they form conductive pathways in the polymer matrix [23], and as fillers in various polymer matrices, such as linear lowdensity polyethylene [34], polypropylene [35], poly (butylene terephthalate) [9], epoxy resin [23,36,37] silicone rubber [38], polyimide [31], polysilazane [39] or poly(methyl methacrylate) [8]. Nanosized Si 3 N 4 particles are also used for various applications because of their high mechanical strength, high fracture toughness, low dielectric constant, and high thermal conductivity [13,40].…”

Section: Introductionmentioning

confidence: 99%

Photocurable acrylate-based composites with enhanced thermal conductivity containing boron and silicon nitrides

Sądej

Gojżewski

Gajewski

et al. 2018

Express Polym. Lett.

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Boron nitride (BN) and silicon nitride (Si 3 N 4) are very promising particulate fillers for production of photocurable composites dedicated to thermally conductive and electrically insulating protective coatings. Composites containing crosslinked methacrylate-based matrices filled with BN or Si 3 N 4 (in amounts up to 5 wt%) were prepared in a fast in situ photocuring process with high conversion (>90%). The monomers were polyethylene glycol dimethacrylate and monomethacrylate (50/50 by weight mixture). Investigations included determination of properties of the monomer/filler compositions, photocuring kinetics and thermal, conductive and mechanical properties of the resulting composites. It was found that addition of the fillers improves polymerization kinetics and mechanical properties compared to the pure polymer matrix. Despite the very low loading level a substantial improvement in thermal conductivity was obtained: a 4-fold increase after addition of only 2 wt% of Si 3 N 4 and 2.5-fold increase after addition of 0.5 wt% of BN. SEM and AFM imaging (with nanoscopic Young's modulus determination) revealed good matrix-filler adhesion for the both types of fillers, tendency of the particles to be preferentially located in the bulk rather than at the interface and formation of thermally conducting paths (for the Si 3 N 4 filler).

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Enhanced through-plane thermal conductivity of boron nitride/epoxy composites

Cited by 279 publications

References 43 publications

Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

Hot pressing-induced alignment of hexagonal boron nitride in SEBS elastomer for superior thermally conductive composites

Photocurable acrylate-based composites with enhanced thermal conductivity containing boron and silicon nitrides

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