Enhancement of dielectric constant of polyimide by doping with modified silicon dioxide@titanium carbide nanoparticles

Zhang, Tong; Han, Bo; Yu, Juan; Wang, Xiaodong; Huang, Pei

doi:10.1039/c8ra01989d

Cited by 16 publications

(9 citation statements)

References 28 publications

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“…As observed in Figure b, the 25 vol% SiCN filled PI composite decomposed at temperatures slightly higher than pure PI (ca. 573.8°C vs 563.2°C) for a 5 wt% mass loss because the SiCN ceramics can overcome higher temperature . The excellent thermal stability of the SiCN/PI composite revealed a good compatibility between the inorganic particles and the polymer matrix .…”

Section: Resultsmentioning

confidence: 97%

Low‐frequency dielectric performance of polyimide composites containing amorphous polymer‐derived SiCN ceramics

et al. 2019

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High-dielectric-constant polymer-matrix composites have potential applications as embedded capacitors. In this paper, an amorphous polymer-derived SiCN ceramic was incorporated into a polyimide (PI) matrix by in situ polymerization for the first time. The resulting SiCN/PI composite showed good thermal stability below 500 C, with the SiCN filler being homogeneously dispersed in the PI matrix. The dielectric properties of the SiCN/PI composites were investigated over a broad frequency range (0.1-10 6 Hz). The dielectric properties of the SiCN/PI composites at low frequencies revealed a weak percolation phenomenon similar to that shown by conductive/polymer composites and the calculated percolation threshold was 22.8 vol%. At SiCN loadings of 25 vol%, the SiCN/PI composites showed a high dielectric constant of 190 at 0.1 Hz, which is 57 times higher than that of pure PI (3.3). The conductivity of the 25 vol% SiCN/PI composite was as low as 8.5 × 10 −10 SÁcm −1 . These results could be explained by the unique microstructure of the polymer-derived SiCN ceramic, containing an amorphous Si matrix and a free carbon phase. This study revealed SiCN/PI composites as promising dielectric materials with promising applications in energy storage fields.

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Section: Resultsmentioning

confidence: 97%

Low‐frequency dielectric performance of polyimide composites containing amorphous polymer‐derived SiCN ceramics

et al. 2019

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“…To decrease the dielectric constant, a range of approaches have been reported, such as chemical modification by low polarized side chains, addition of different fillers into the polymer, introduction of porous materials into the polymer, or construction of porous materials to produce voids directly . Bong et al introduced a trifluoromethyl group into the side chain of PI and reduced the dielectric constant to 2.6 .…”

Section: Characteristics Of the 6fda‐oda Pi Filmmentioning

confidence: 99%

Superhydrophobic and Low‐k Polyimide Film with Porous Interior Structure and Hierarchical Surface Morphology

Dong

et al. 2019

Macro Materials & Eng

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Porous interior structured polyimide (PI) films with a hierarchical surface are fabricated from 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride and 4,4′‐oxydianiline by a water vapor induced phase separation process under a humid environment. Superhydrophobic properties with a water contact angle of 161° are obtained using the hierarchical surface morphology, which can be adjusted from flower‐like to wrinkle‐shape particles facilely by changing the relative humidity. The dielectric constant (k) of the PI film decreases sharply from 2.8 (film prepared under dry conditions) to ≈1.9 (film prepared under humid conditions) because of the interior porous structure and fluorine‐containing framework. Both a low‐k and superhydrophobicity are very important parameters for PI films in microelectronic and insulating applications.

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“…33,34 Zhang et al prepared a PI/SiO 2 @TiC composite and proved that the addition of SiO 2 @TiC particles to PI is suitable for improving its dielectric properties while maintaining its flexibility. 35 The three-phase hybrid method is a good way to improve dielectric properties while retaining insulting properties. Fillers such as SiO 2 and BNNS are used in this work.…”

Section: Introductionmentioning

confidence: 99%

Microstructures and dielectric properties of fluorene polyester ternary nanocomposites optimized by zero‐dimensional and two‐dimensional fillers

Zhang

Wen

Guan

et al. 2022

J of Applied Polymer Sci

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Due to the limitations of dielectric, insulating and mechanical properties, pure polymers could not satisfy the requirements of technological development.Using inorganic fillers with excellent performance to modify it is the mainstream method at present. Ternary hybrid polymer composites can use fillers with excellent dielectric properties to improve their dielectric properties, showing potential in improving electrical insulation, dielectric, and other fields. In this work, fluorene polyester (FPE) films of different components are prepared by the solution blending method using zero-dimensional silica (SiO 2 ) nanoparticles and two-dimensional boron nitride nanosheets (BNNS) as fillers.Compared with SiO 2 /FPE composite films, ternary films exhibit better dielectric properties, short-term breakdown strength and corona-resistant lifetime.By investigating the interface features of BNNS, SiO 2 nanoparticles and FPE matrix as well as the microstructure and properties of the films, the synergism mechanism of BNNS and SiO 2 nanoparticles on the performance of FPE composite films is explored. The dielectric properties of the composites are investigated, including dielectric constant, breakdown strength, and corona-resistant lifetime. This article focuses on clarifying the key role of BNNS in the electrical properties of ternary films and provides a theoretical basis for expanding the application of 2D materials in the field of high insulation.

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Enhancement of dielectric constant of polyimide by doping with modified silicon dioxide@titanium carbide nanoparticles

Abstract: PI/SiO2@TiC composites with enhanced dielectric constant are synthesized by hydrolysis of TEOS into microspheres forming a thin SiO2 layer on the TiC surface followed by mechanical blending of ODA and PMDA.

Cited by 16 publications

References 28 publications

Low‐frequency dielectric performance of polyimide composites containing amorphous polymer‐derived SiCN ceramics

Low‐frequency dielectric performance of polyimide composites containing amorphous polymer‐derived SiCN ceramics

Superhydrophobic and Low‐k Polyimide Film with Porous Interior Structure and Hierarchical Surface Morphology

Microstructures and dielectric properties of fluorene polyester ternary nanocomposites optimized by zero‐dimensional and two‐dimensional fillers

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