Enhancement of interface anchoring and densification of Y2O3 coating by metal substrate manipulation in aerosol deposition process

Kim, Jinwoo; Lee, Je In; Park, Dong Soo; Park, Eun Soo

doi:10.1063/1.4905241

Cited by 17 publications

(11 citation statements)

References 22 publications

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“…Generally, ceramic particles with high hardness during the AD process can form the anchoring layers on metal and glass substrate with relatively low hardness [23]. However, with metallic particles that have a ductile property, it is difficult to form the anchoring layer on the hard ceramic substrate.…”

Section: Resultsmentioning

confidence: 99%

Characteristics and Mechanism of Cu Films Fabricated at Room Temperature by Aerosol Deposition

et al. 2016

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We were successful in growing a dense Cu film on Al2O3 substrates at room temperature using an aerosol deposition (AD) method. The characteristics of Cu films were investigated through electrical resistivity and X-ray photoelectron spectroscopy (XPS). The resistivity of Cu films was low (9.2–12.5 μΩ cm), but it was five to seven times higher than that of bulk copper. The deterioration of the resistivity indicates that a Cu2O phase with CuO occurs due to a particle-to-particle collision. Moreover, the growth of Cu films was investigated by observing their microstructures. At the initial stage in the AD process, the impacted particles were flattened and deformed on a rough Al2O3 substrate. The continuous collision of impacted particles leads to the densification of deposited coating layers due to the plastic deformation of particles. The bonding between the Cu particles and the rough Al2O3 substrate was explained in terms of the adhesive properties on the surface roughness of Al2O3 substrates. It was revealed that the roughness of substrates was considerably associated with the mechanical interlocking between Cu particles and rough Al2O3 substrate.

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Section: Resultsmentioning

confidence: 99%

Characteristics and Mechanism of Cu Films Fabricated at Room Temperature by Aerosol Deposition

et al. 2016

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“…Several theoretical and experimental works have focused on film deposition mechanisms . The possibility of partial or total melting of the ceramic particles at the local scale during collision has been ruled out by simulation and experimental results .…”

Section: Introductionmentioning

confidence: 99%

“…Several theoretical and experimental works have focused on film deposition mechanisms. 1,6,20,21 The possibility of partial or total melting of the ceramic particles at the local scale during collision has been ruled out by simulation and experimental results. 1,7 However, the local temperature rise at the substrate-film interface should be considered with respect to the thermal conductivity of the substrate materials, eg, the metal can dissipate heat more easily than the glass.…”

Section: Introductionmentioning

confidence: 99%

Revealing the effects of aerosol deposition on the substrate‐film interface using NaCl coating

Khansur

Eckstein

et al. 2019

J Am Ceram Soc

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Aerosol deposition is a feasible method of fabricating dense ceramic films at room temperature by the impact consolidation of submicron‐sized particles on ceramic, metal, glass, and polymer substrates at a rapid rate. Despite the potential usefulness of the aerosol deposition process, there are issues, such as deposition mechanisms and structure of the film‐substrate interface, that are not well understood. We have used complementary structural and microstructural analysis to capture the state of the substrate surface after the aerosol deposition process. The results reveal that modification of the substrate surface by the ejected submicron‐sized particles is essential for the formation of anchoring layer, thereby, a change in internal residual stress state and surface free energy of the substrate is required to deposit film using AD process. Our analysis also suggests that the adhesion between the metal substrate and ceramic particles is possibly contributed by both physical bonding and mechanical interlocking.

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“…Consequently, this roughened yet dense interface (typical in the height range of 200 nm to 700 nm) supports a mechanical clamping. 64,65 Additionally, interactions in form of ionic and covalent bonding between metallic atoms of the substrate and oxide ions from the alumina PAD film have been reported, that may also improve the film adhesion. 66 2. a high, near theoretical film density: the nanocrystalline, dense microstructure without pores, except for some nanopores, improves the cohesion of the coating material within the film.…”

Section: Accepted Articlementioning

confidence: 99%

Making powder aerosol deposition accessible for small amounts: A novel and modular approach to produce dense ceramic films

Exner

Linz

Kita

et al. 2021

Int J Applied Ceramic Tech

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Powder aerosol deposition is a promising technique to deposit dense ceramic films directly at room temperature. While previous developments pointed towards larger and more complex deposition devices, this work follows a different approach and proposes a simplified and miniaturized coating device (denoted as Micro-PAD, µPAD). The aim is twofold: creating a smaller and flexible device consisting of an aerosol generation unit and a deposition chamber with a combined low areal footprint of 30 cm by 20 cm (that, e.g., easily fits in a glove box) as well as lowering the hurdle for other researchers to use the powder aerosol deposition. Therefore, we introduce a device mainly based on commercially available components/connectors as well as manual operated valves/flow meters. A key point is the elimination of moving components by just using a spot deposition that was enabled by using a circular de-Laval-type nozzle.The operational capability of µPAD is proven for the deposition of alumina films and compared to conventional PAD in terms of mechanical, crystalline, and optical film properties. Thick films with a bell-shape-like profile are deposited by µPAD, featuring a plateau in the center of the film with a diameter of 5 mm and a FWHM (full width at half maximum) diameter of about 10 mm. Alumina films produced by µPAD do not only match the properties of corresponding PAD films, but oftentimes outperform them. Here, µPAD films exhibit increased hardness and optical transmittance values, surpassing reference values of the conventional sprayed counterparts by at least 10 %. Also, film integrity and adhesion to the substrate are slightly higher in case of µPAD. Reasons for the improved film properties are found by X-ray diffraction, with a significantly higher fracturing of impacting particles during µPAD combined with improved film consolidation as observed by SEM.

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Enhancement of interface anchoring and densification of Y2O3 coating by metal substrate manipulation in aerosol deposition process

Cited by 17 publications

References 22 publications

Characteristics and Mechanism of Cu Films Fabricated at Room Temperature by Aerosol Deposition

Characteristics and Mechanism of Cu Films Fabricated at Room Temperature by Aerosol Deposition

Revealing the effects of aerosol deposition on the substrate‐film interface using NaCl coating

Making powder aerosol deposition accessible for small amounts: A novel and modular approach to produce dense ceramic films

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