1995
DOI: 10.1063/1.360178
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Enhancement of material ablation using 248, 308, 532, 1064 nm laser pulse with a water film on the treated surface

Abstract: Many industrial laser processes, such as surface cleaning, require the removal of small thicknesses of matter, often on large samples. An experimental study has been performed in order to characterize and enhance the ablation of materials by means of the interaction between a pulsed laser beam and matter using common industrial laser sources, particularly at 248, 308, 532, and 1064 nm. Ablation was achieved on a static sample with one or several successive pulses and for different energy densities. These param… Show more

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Cited by 84 publications
(38 citation statements)
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“…[175] the authors used a 248 nm wavelength KrF excimer laser to ablate Si wafer under water thickness of 1 mm and reported the similar results. Likewise, the high ablation rate validations can be found in [160] for stainless steel, alumina, silica and in [166] for glass, stainless steel and polymers with steady results. …”
Section: High Ablation Ratementioning
confidence: 76%
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“…[175] the authors used a 248 nm wavelength KrF excimer laser to ablate Si wafer under water thickness of 1 mm and reported the similar results. Likewise, the high ablation rate validations can be found in [160] for stainless steel, alumina, silica and in [166] for glass, stainless steel and polymers with steady results. …”
Section: High Ablation Ratementioning
confidence: 76%
“…On the other hand, as the energy absorbance depends on the material wavelength, therefore, the selection of incident laser wavelength, preferably, be such that it should strongly be absorbed by the target matter rather than water film. Based on this statement, Dupont et al [160] claimed that a high ablation rate (2-15 times) for high laser intensities can be achieved if the laser wavelength is chosen in accordance with work material's wavelength. It has been proven that the energy absorbance does not depend on the layer thickness but the incident light wavelength.…”
Section: Water Layer Thicknessmentioning
confidence: 96%
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“…High aspect ratio grooves are difficult to machine mostly due to obstruction for plasma plume expansion and accordingly material removal, which then tends to stick to sidewalls. It is proposed that depending on laser parameters irradiated liquids can experience formation of the shock wave, vapour expansion, cavitations, and breakdown [30,32]. All these phenomena primarily result in disturbance of incident beam, increased laser power losses, and irregularities of machining, although values for surface roughness and cleanliness can be enhanced.…”
Section: Resultsmentioning
confidence: 99%
“…There has been done various experimental research with liquid assistance for laser machining [29][30][31]. This has motivated laser steam cleaning for the machining of rectangular grooves in steel to be examined.…”
Section: Resultsmentioning
confidence: 99%