2010
DOI: 10.1016/j.ijheatmasstransfer.2010.02.025
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Enhancement of pool-boiling heat transfer using nanostructured surfaces on aluminum and copper

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Cited by 173 publications
(62 citation statements)
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“…6) with maximum feature sizes of about 100 lm. 2 With the use of highly conductive copper and aluminum surfaces, functionalization is typically achieved with chemical etching processes or deposition techniques which result in maximum feature sizes of only a few microns, [9][10][11][12][13][14][15][16][17][18] and a moderate increase in critical heat flux and heat transfer coefficient. However, limited research on surface functionalization has been conducted on lower thermal conductivity metallic materials.…”
mentioning
confidence: 99%
“…6) with maximum feature sizes of about 100 lm. 2 With the use of highly conductive copper and aluminum surfaces, functionalization is typically achieved with chemical etching processes or deposition techniques which result in maximum feature sizes of only a few microns, [9][10][11][12][13][14][15][16][17][18] and a moderate increase in critical heat flux and heat transfer coefficient. However, limited research on surface functionalization has been conducted on lower thermal conductivity metallic materials.…”
mentioning
confidence: 99%
“…It is reported that the presence of this layer alters the surface wettability and roughness and number of nucleation site present on the surface [29][30][31][32][33][34][35][36][37]. The reduction in evaporator wall temperature for decreasing heat flux at heat pipe with 5 wt.% of NF compared with other cases may be attributed to the effect of NFs on vapor bubble formation by bombarding the vapor bubbles by nanoparticles during their formation [38], the increase of active nucleation site density and bubble departure frequency [28,[39][40][41]. In fact, the problem of blocking the liquid to be supplied to the entire evaporator surface at higher heat fluxes may be eliminated by bombarding the vapor bubbles during their formation with nanoparticles.…”
Section: Resultsmentioning
confidence: 99%
“…Solids have thermal conductivities that are orders of magnitude larger than those of traditional heat transfer fluids. Small solid particles (nanoparticles) of high thermal conductivity with size below 100 nm can suspend in aqueous solutions of surfactants or solvents without damaging the structure of heat transfer systems [32] (i.e., there is no abrasion or clogging). Colloidal suspensions have shown intriguing thermal performances,particularly regarding the following four points: (1) increased thermal conductivity (~150%);(2) increased single-phase heat transfer coefficient (~60%);(3) increased critical heat flux with extended nucleate boiling regime (~200%);and (4) improved quenching efficiency.…”
Section: Fluid-modification Technology (Nanofluid Technology)mentioning
confidence: 99%