Enhancement of SAC105 solder for vacuum soldering with Cu substrates through incorporation of activated Ti nanoparticles

Wu, ChuanJiang; Zhang, Liang; Chen, Chen; Lu, Xiao

doi:10.1016/j.jmrt.2023.11.265

Journal of Materials Research and Technology

2024

DOI: 10.1016/j.jmrt.2023.11.265

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Enhancement of SAC105 solder for vacuum soldering with Cu substrates through incorporation of activated Ti nanoparticles

ChuanJiang Wu,

Liang Zhang,

Chen Chen

et al.

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Cited by 8 publications

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Enhancement of SAC105 solder for vacuum soldering with Cu substrates through incorporation of activated Ti nanoparticles

Cited by 8 publications

References 48 publications

Microstructure and mechanical behavior of Graphene NanoSheets enhanced lead-free Sn–0.3Ag–0.7Cu solder

Microstructure and mechanical behavior of Graphene NanoSheets enhanced lead-free Sn–0.3Ag–0.7Cu solder

Effect of Si3N4 nanoparticles on IMC as well as mechanical properties of Sn58Bi/Cu solder joints during thermal aging

Interfacial reaction and strengthening mechanism of thermo-compression bonding foam Ni reinforced SAC105 and SAC105–0.3Ti solder joints

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