Enhancement of Saturation Boiling of PF-5060 on Microporous Surface

Abstract

Pool boiling experiments were conducted to investigate the saturation boiling of PF-5060 dielectric liquid on micro porous copper surface. The micro porous surface is deposited on a copper coated silicon wafer diced to a size of 40 mm × 68 mm. Reference experiments were performed using a bare silicon wafer of the same size. Experiments are also performed using deionized water that was degassed prior to the experiment. The experimental results show that there is ∼48% enhancement of heat flux in nucleate boiling regime on the micro porous copper surface, compared to that on a bare surface for pool boiling of PF-5060. The measurement uncertainty for heat flux in these experiments is estimated to be ∼15%. The enhanced surface area provided by the micro porous copper surface as well as the reduction in the magnitude of the Taylor instability wavelength on a copper surface, increase in the nucleation site density on the porous surface, capillary replenishment of the dry out regions and the increase in transient heat transfer from the porous surface — are postulated to be the enhancement mechanisms for the observed augmentation in heat flux values.

Numerical Investigation of the Effect of Chirality of Carbon Nanotube on the Interfacial Thermal Resistance

“…30,31,[38][39][40][41] In these studies, the significant enhancement of heat flux values were observed during pool boiling of refrigerants on a heater coated with carbon nanotube coating (when compared with flat heater surfaces), The enhancements were observed for both nucleate and file boiling regimes as well as for critical heat flux (CHF)…”