Enhancement of the critical heat flux by using heat spreader

Yoon, Yong-Sik; Yang, Hyun; Kwak, Ho‐Young

doi:10.1007/bf02982991

Cited by 3 publications

(2 citation statements)

References 11 publications

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“…Effective heat spreading has been implemented by previous investigators interested in heat transfer augmentation including the work of [2], which used anisotropic heat plate with preferential thermal conductivity to augment thermal performance. In the study of [3], the critical heat flux of a heat spreader was quantified. While in [4], the use of diamond coated materials was researched.…”

Section: Introductionmentioning

confidence: 99%

STAR CCM+ CFD Simulations of Enhanced Heat Transfer in High-Power Density Electronics Using Forced Air Heat Exchanger and Pumped Fluid Loop Cold Plate Fabricated from High Thermal Conductivity Materials

Anderson¹,

Devost²,

Pakdee³

et al. 2013

JECTC

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As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans in unison with pumped fluid loops in order to meet temperature and performance requirements. This research paper presents results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m 2) electronics packaging scenarios. Trade studies involving different heat exchanger/cold plate materials, as well as various fault scenarios within a mock-up of a typical electronics system, are used to illustrate the upper bounds placed on the convective heat transfer coefficient. Agreement between our present findings and previous research in the field of electronics cooling is presented herein.

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Section: Introductionmentioning

confidence: 99%

STAR CCM+ CFD Simulations of Enhanced Heat Transfer in High-Power Density Electronics Using Forced Air Heat Exchanger and Pumped Fluid Loop Cold Plate Fabricated from High Thermal Conductivity Materials

Anderson¹,

Devost²,

Pakdee³

et al. 2013

JECTC

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show abstract

“…Very recently, Honda et al [12] have obtained a considerable heat transfer enhancement at the nucleate boiling region and 230% increase in the CHF from the micro-pin-finned chip with submicronscale roughness. Further the CHF as much as 120 W/cm 2 in FC-72 was obtained by increasing the effective area for boiling region using a heat spreader [13].…”

Section: Introductionmentioning

confidence: 99%

Effect of surface condition on boiling heat transfer from silicon chip with submicron-scale roughness

Jung

Kwak

2006

International Journal of Heat and Mass Transfer

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Prediction Models of Saturated Vapor Pressure, Saturated Density, Surface Tension, Viscosity and Thermal Conductivity of Electronic Fluoride Liquids in Two-Phase Liquid Immersion Cooling Systems: A Comprehensive Review

Huang

Youxiang

et al. 2023

Applied Sciences

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As the carriers of massive data, data centers are constantly needed to process and calculate all kinds of information from various fields and have become an important infrastructure for the convenience of human life. In recent years, the data center market has been thriving in China. However, the problems of high power consumption and poor heat dissipation are also being faced. One of the most effective solutions to these problems is to adapt a two-phase liquid immersion cooling technology, which is a more energy-saving and efficient method than the traditional cooling methods; the reason for this is mainly that in two-phase liquid immersion cooling technology, the heat transfer caused by the phase change of liquid coolants (electronic fluoride liquids) helps to cool and improve the temperature uniformity of electronic components. However, the requirements for the electronic fluoride liquids used in two-phase liquid immersion cooling systems are strict. The thermophysical properties (saturated vapor pressure, density, surface tension, viscosity, thermal conductivity and latent heat of vaporization, etc.) of the liquid coolants play a very key role in the heat dissipation capacity of two-phase liquid immersion cooling systems. However, it is not always easy to obtain new electronic fluoride liquids under many actual conditions and reasonable prediction models of their thermophysical properties could contribute to the preliminary screening of the coolants. Thus, the prediction models of their key thermophysical properties (saturated vapor pressure, saturation density, surface tension, viscosity and thermal conductivity) are reviewed, and the accuracy and practicality of these prediction models in predicting the thermophysical properties of electronic fluoride liquids (FC-72, HFE-7100 and Novec 649) are evaluated. This work will provide a valuable reference for actual engineering applications.

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Enhancement of the critical heat flux by using heat spreader

Cited by 3 publications

References 11 publications

STAR CCM+ CFD Simulations of Enhanced Heat Transfer in High-Power Density Electronics Using Forced Air Heat Exchanger and Pumped Fluid Loop Cold Plate Fabricated from High Thermal Conductivity Materials

STAR CCM+ CFD Simulations of Enhanced Heat Transfer in High-Power Density Electronics Using Forced Air Heat Exchanger and Pumped Fluid Loop Cold Plate Fabricated from High Thermal Conductivity Materials

Effect of surface condition on boiling heat transfer from silicon chip with submicron-scale roughness

Prediction Models of Saturated Vapor Pressure, Saturated Density, Surface Tension, Viscosity and Thermal Conductivity of Electronic Fluoride Liquids in Two-Phase Liquid Immersion Cooling Systems: A Comprehensive Review

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