Enhancement of thermal conductivity for epoxy laminated composites by constructing hetero‐structured GF/BN networks

Abstract

Due to the rapid development of multifunctional and miniaturized electronic devices, the demand for polymer composites with mechanical properties, highthermal conductivity, and dielectric properties is increasing. Therefore, the heat dissipation capacity of the composite must be improved. To solve this problem, we report a glass fabric (GF)/boron nitride (BN) network with a highly thermally conductive hetero-structured formed using polyvinyl alcohol (PVA) as an adhesive. The GF and BN are furtherly modified by (3-aminopropyl)triethoxysilane (APTES) for better thermal conductivity enhancement. When the BN content is 30%, the thermal diffusion coefficient and thermal conductivity of obtained PVA-mBN@mGF (PBG) are 2.843 mm 2 /s and 1.394 W/(m K), respectively. Epoxy (EP) resin is then introduced to prepare PBG/mBN/EP laminated composites via the hot pressing method as applied as thermal conductive composites. A highest thermal conductivity of 0.67 W/(m K) of PBG/mBN/EP laminated composites is obtained, three times higher than that of pure EP. In addition, the PBG/mBN/EP laminated composites also present favorable mechanical, electrically insulating, and dielectric properties.

Recyclable thermally conductive poly(butylene adipate‐co‐terephthalate) composites prepared via forced infiltration

“…The miniaturization of equipment size brings great challenge to heat dissipation. [1][2][3][4][5][6][7] The insufficient internal heat dissipation of electronic components will result in the substantial reduction of equipment life and stability. [8][9][10][11][12] Therefore, there exist urgent needs for thermal interface material (TIM) with excellent thermal conductivity to improve the heat dissipation capacity of heat-producing equipment.…”

“…At present, electronic equipment are rapidly developing toward the direction of high power and high energy consumption. The miniaturization of equipment size brings great challenge to heat dissipation 1–7 . The insufficient internal heat dissipation of electronic components will result in the substantial reduction of equipment life and stability 8–12 .…”

Utilizing a multi‐layer structure to regulate the thermal conductivity of an advanced BN + EP composite insulation material: Effects of content, number of layers, and curing temperature on composites

“…29 Chenglin Li prepared a PBG/mBN/EP layered composite material by hot pressing, which was used as a thermally conductive composite material, reaching the highest thermal conductivity of 0.67 W/(m K). 30 Fengmei Guo used BNNSs and reduced graphene oxide (rGO) to rationally assemble into a well-arranged micro-sandwich structure in polyimide (PI) composites, with a thermal conductivity of 1.49 W/(mÁK). 31 However, even so, these research results are still far from the actual large-scale industrial production applications, such as various types of chip packaging, and packaging of large motors.…”

“…And the material achieved a thermal conductivity of 16.3 W/(m K) 29 . Chenglin Li prepared a PBG/mBN/EP layered composite material by hot pressing, which was used as a thermally conductive composite material, reaching the highest thermal conductivity of 0.67 W/(m K) 30 . Fengmei Guo used BNNSs and reduced graphene oxide (rGO) to rationally assemble into a well‐arranged micro‐sandwich structure in polyimide (PI) composites, with a thermal conductivity of 1.49 W/(m·K) 31 .…”

Ultrasonic-Assisted Method for the Preparation of Carbon Nanotube-Graphene/Polydimethylsiloxane Composites with Integrated Thermal Conductivity, Electromagnetic Interference Shielding, and Mechanical Performances

“…Thermal conductive polymer composites are gaining interest and application as thermal management materials in the microelectronics and energy industries due to their low cost, good chemical resistance, light weight, and excellent mechanical properties [ 6 , 7 , 8 , 9 , 10 , 11 ]. However, the inherent low thermal conductivity of polymeric materials (0.1 to 0.5 W/(m·K)) limits their engineering applications as thermal management materials [ 12 , 13 , 14 , 15 , 16 , 17 ]. In order to improve the thermal conductivity of polymeric materials, the addition of thermally conductive fillers to improve the thermal conductivity of polymer composites is the easiest [ 18 , 19 , 20 ].…”