Enhancing directional thermal conductivity in hexagonal boron nitride reinforced epoxy composites through robust interfacial bonding
Mostafa Mehdipour,
Semih Doğan,
Marjan Hezarkhani
et al.
Abstract:Establishing a robust interfacial bond between hexagonal boron nitride (h‐BN) plates and the epoxy matrix is essential for enhancing heat transfer, which is difficult because of h‐BN's low‐surface energy, tendency to clump together, and the chemical inertness of the epoxy matrix. This research shows different techniques for treating the surface of h‐BN fillers by applying acids and thermal processes to activate the surface. The silanization process was used to increase the silane content on the surface of acti… Show more
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