2018
DOI: 10.1016/j.solmat.2018.08.016
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Enhancing stability for organic-inorganic perovskite solar cells by atomic layer deposited Al2O3 encapsulation

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Cited by 79 publications
(60 citation statements)
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“…They realized that holes need to be transported through tunneling, so the Al 2 O 3 passivation layer must be very thin, as thin as about 1 nm. In addition, Al 2 O 3 can also act as an encapsulant . Bai et al designed a new method to wrap the perovskite grains with oligomeric silica (OS) to form a core–shell structure, which not only passivated the surface and grain boundaries, but also fine‐tuned the grain size ( Figure 9 a) .…”
Section: Passivation Of Perovskite Layermentioning
confidence: 99%
“…They realized that holes need to be transported through tunneling, so the Al 2 O 3 passivation layer must be very thin, as thin as about 1 nm. In addition, Al 2 O 3 can also act as an encapsulant . Bai et al designed a new method to wrap the perovskite grains with oligomeric silica (OS) to form a core–shell structure, which not only passivated the surface and grain boundaries, but also fine‐tuned the grain size ( Figure 9 a) .…”
Section: Passivation Of Perovskite Layermentioning
confidence: 99%
“…Instabilities include i) material degradation when exposed to heat, UV light and moisture, and ii) operational hysteresis under different bias scan direction and rates . Solar cell degradation by heat stress could be categorized as an intrinsic that can be alleviated by improving the perovskite material itself and the transport layers such as spiro‐MeOTAD that degrade at high temperatures . UV instability is mainly related to TiO 2 as discussed in the previous section.…”
Section: Passivation Approaches In the Fabrication Of Perovskite Layermentioning
confidence: 99%
“…In order to minimize moisture-induced degradation of perovskite-based solar cells, a variety of approaches have been taken, such as compositional tailoring, 12,13 interfacial engineering, 14,15 encapsulation 16,17 and so on. One attractive approach is the use of mesoscopic engineering.…”
Section: Introductionmentioning
confidence: 99%