Enhancing the electrical insulation of highly thermally conductive carbon fiber powders by SiC ceramic coating for efficient thermal interface materials

Hu, Xianglong; Huang, Min; Kong, Nizao; Han, Fei; Tan, Ruixuan; Huang, Qizhong

doi:10.1016/j.compositesb.2021.109398

Cited by 43 publications

(10 citation statements)

References 42 publications

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“…In addition to insulating thermal fillers, carbon-based materials [7][8][9][10][11][12][13] are also commonly used as conductive thermal fillers. These materials often exhibit high TC and low cost due to the involvement of free electrons in the heat conduction process.…”

Section: Introductionmentioning

confidence: 99%

“…However, the challenge lies in forming a continuous conductive network with such fillers. Hu et al [7] utilized a combination of silicon carbide (SiC) and carbon fiber powders to disrupt the conductive network formed by carbon fiber powder while maintaining excellent TC in the network composed of both materials. In this study, a method was employed to achieve incremental curing of SR on the surface of cured SR. A thin layer of insulating thermally conductive SR was applied to the surface of the conductive thermally conductive SR composite.…”

Section: Introductionmentioning

confidence: 99%

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Study on the effects of incremental curing on the thermal conductivity, insulation, and mechanical properties of thermal conductive silicone rubber

Zhang,

Qiu,

Sakai

et al. 2024

J. Phys.: Conf. Ser.

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With the development of fields such as electronics and telecommunications, electronic devices are becoming more integrated and powerful. Therefore, there is an increasing demand for high thermal conductive and insulating flexible materials. Silicone rubber (SR), as an excellent flexible substrate, is often combined with various thermal conductive fillers to enhance its thermal conductivity (TC). Carbon materials are commonly used as thermally conductive fillers. To improve the insulation performance while maintaining the TC of the material, uncured SR filled with boron nitride (BN) is used as an insulating layer on the same substrate. The TC of the once-cured BN/SR composite and the incremental cured BN/SR composite as a coating are 0.492 W/(mK) and 0.484 W/(mK), respectively, with a BN content of 10 vol%. The TC of carbon fiber (CF)/SR composites before and after surface treatment with BN/SR are 1.760 W/(mK) and 1.682 W/(mK), respectively, with a CF content of 20 vol%. The volume resistivity of the former is less than 104 Ω cm, while the latter is greater than 1014 Ω cm.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Study on the effects of incremental curing on the thermal conductivity, insulation, and mechanical properties of thermal conductive silicone rubber

Zhang,

Qiu,

Sakai

et al. 2024

J. Phys.: Conf. Ser.

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“…4 This can be achieved through the development of thermal interface materials (TIM), which are used to decrease contact resistance by eliminating the interfacial air gap at the contact surface with the elements. 5,6 The automotive industry is currently transitioning from gasoline to electric vehicles, and the precision of the devices used in these vehicles have advanced accordingly. In particular, the materials used to construct the power modules that control the batteries have shifted from silicon to wide-bandgap (WBG) semiconductors such as silicon carbide.…”

Section: Introductionmentioning

confidence: 99%

Enhancement of the effective thermal conductivity of iron oxide‐coated hexagonal boron nitride/polyimide composite sheets using samarium–cobalt magnets

Itaoka

Matsubayashi

Haruki

2023

J of Applied Polymer Sci

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The orientation and distribution of the filler in hexagonal boron nitride (hBN) coated with iron oxide (Fe3O4@hBN)/polyimide (PI) composite sheets were controlled via magnetic field treatment (MFT) to enhance the effective thermal conductivity (TC) in the out‐of‐plane direction. Filler chain structures gradually formed in the direction of the magnetic field in the precursor solution. The effective TC of the Fe3O4@hBN/PI sheet after MFT was much higher than that of pristine hBN/PI. The effective TC of the composites was preferably improved by placing the sample near a one‐sided magnet instead of in the middle of a pair of magnets. The effective TC of 10, 20, and 30 vol% Fe3O4@hBN/PI composites improved by 59%, 53%, and 35%, respectively, compared to that of pristine hBN/PI for a magnet distance of 10 mm and with the sample placed 2 mm from the bottom magnet. These values are in good agreement with those reported in the literature using MFT. The tensile strengths of the 10, 20, and 30 vol% Fe3O4@hBN/PI composites prepared using MFT were 33%, 33%, and 22% lower, respectively, than those of the composites prepared without MFT.

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“…In the realm of electrical applications, the desirability of possessing robust thermal and electrical conductivities is widely acknowledged. − However, there exist scenarios where materials exhibiting electrical insulation alongside thermal conduction find utility. − Notably, such materials find application as thermally conductive electrical insulators, , facilitating thermal management in electronics, enhancing sensor capabilities, and enabling the development of efficient thermal barrier coatings . It is important to note that the relationship between electrical and thermal conductivities is intimately intertwined.…”

Section: Introductionmentioning

confidence: 99%

Electrical and Thermal Properties of Surface-Modified Copper Nanowire/Polystyrene Nanocomposites through Latex Blending

Eom,

Kim,

Jang

et al. 2023

ACS Omega

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The incorporation of conductive nanofillers into an insulating polymer matrix commonly leads to nanocomposites with good electrical, thermal, and mechanical properties. In this study, copper nanowires (CuNWs) and polystyrene (PS) microspheres were synthesized along with the fabrication of CuNW/PS polymer nanocomposites. The electrical, thermal, mechanical, rheological, and morphological properties of the CuNW/PS nanocomposites were examined. The CuNWs were homogeneously dispersed in the PS matrix through latex blending. For the CuNW/PS nanocomposites, the storage modulus was higher than the loss modulus at all frequencies, indicating their elastic-dominant behavior. The electrical and thermal conductivities of the nanocomposites increased with an increasing CuNW content. Using a mixed dispersion of two monodisperse PS particles of 500 nm and 5 μm in diameter resulted in the highest electrical conductivity (ca. 10° S/m for 30 wt % nanofillers) among the nanocomposites. In addition, the introduction of silica- and polydopamine-coated CuNWs as nanofillers imparted insulation properties to the nanocomposites, with electrical conductivities to 10 –10 –10 –8 S/m. When using 500 nm PS particles, the thermal conductivity of the surface-modified CuNW/PS nanocomposite at 30 wt % of CuNW was enhanced to 0.22 W/m·K compared to 0.17 W/m·K for its unmodified counterpart. We have achieved multiple innovative approaches, including the use of mixed particle sizes, surface modification of CuNW, and the exploration of elastic-dominant behavior. This enhanced thermal conductivity, coupled with the attainment of insulation properties, presents a distinct advantage for thermal interface material (TIM) applications.

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Enhancing the electrical insulation of highly thermally conductive carbon fiber powders by SiC ceramic coating for efficient thermal interface materials

Cited by 43 publications

References 42 publications

Study on the effects of incremental curing on the thermal conductivity, insulation, and mechanical properties of thermal conductive silicone rubber

Study on the effects of incremental curing on the thermal conductivity, insulation, and mechanical properties of thermal conductive silicone rubber

Enhancement of the effective thermal conductivity of iron oxide‐coated hexagonal boron nitride/polyimide composite sheets using samarium–cobalt magnets

Electrical and Thermal Properties of Surface-Modified Copper Nanowire/Polystyrene Nanocomposites through Latex Blending

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