Macromol. Res.
 2024
DOI: 10.1007/s13233-024-00317-y
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Enhancing the thermal conductivity of epoxy molding compounds by adding SiO2-embedded carbon nanofibers for semiconductor packaging applications

Yeon-Ryong Chu,
Zambaga Otgonbayar,
Gyu-Sik Park
et al.
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