Environment-adaptive, anti-fatigue thermal interface graphene foam

Chen, Yanru; Pang, Kai; Liu, Xiaoting; Li, Kaiwen; Lu, Jiahao; Cai, Shengying; Liu, Yingjun; Xu, Zhen; Gao, Chao

doi:10.1016/j.carbon.2023.118142

Cited by 11 publications

(1 citation statement)

References 65 publications

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“…As shown in Figure a, GP presented a clearly orientated and densely packed structure. After expansion, GP was transferred into a foam state, but the morphology of EEG was a quasi-hyperbolic framework (Figure b,c), − which was quite different to those foams obtained by the ice template ,− or acid expansion method …”

Section: Resultsmentioning

confidence: 87%

Quasi-Hyperbolic Framework Graphite Foam-Based Composites with High Thermal Conductivity and Electromagnetic Shielding Properties Fabricated by an Electrochemical Expansion Method

Zhang,

Fang,

Zhou

et al. 2024

ACS Appl. Mater. Interfaces

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Nowadays, the rapid development of electronic devices requires composites with high thermal conductivity and good electromagnetic shielding properties. The key challenge lies in the construction of high-performance conductive networks. Herein, an electrochemical expansion graphite foam (EEG) with a quasi-hyperbolic framework was prepared by an electrochemical expansion method, and then the epoxy resin (EP) was filled to fabricate the composites. The graphite plate was first electrochemically intercalated and then foamed, in which plasticization was caused by weak oxidation in intercalation and the quasihyperbolic framework was induced by foaming during expansion. These processes were characterized by Fourier transform infrared (FTIR), micro-Raman, X-ray photoelectron spectroscopy (XPS), and so on. Based on the highly efficient quasi-hyperbolic framework and high-quality graphite structure, the thermal conductivity of the composite reached 43.523 W/(m•K), and total electromagnetic interference (EMI) shielding (SE T ) reached 105 dB. The heat transfer behavior was simulated by finite element analysis (FEA) in detail. This method of preparing high thermal conductivity and electromagnetic shielding materials has a good application prospect.

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