Polymer
semiconductors have exhibited their perspective in flexible,
stretchable, and wearable electronics, where high-performance polymer
semiconductors are always expected for high device performance. Various
directional alignment techniques have been put forward to enhance
device performance. However, not all these techniques are suitable
on flexible substrates. Solution-based deposition also suffers the
risk of interface degradation between semiconducting/dielectric layers
and therefore the degradation of device performance. A film transfer
technique is one of promising measures to solve these problems. We
developed a simple and reliable thermal release transfer technique
to transfer well-aligned and centimeter-scaled polymer semiconducting
film from rigid to flexible substrates. A friction-transferred polytetrafluoroethylene
template on silicon was used to guide the anisotropic crystallization
of organic semiconducting film. The semiconducting film was transferred
onto a flexible substrate via thermal release tape whose adhesion
was modulated by proper annealing treatment. The flexible device based
on such transferred and well-aligned semiconducting film presented
the largest carrier mobility of 1.02 cm2 V–1 s–1 and the largest on/off ratio of 2.6 ×
104 than the other control devices. Bending measurements
further proved that such devices presented good endurance on both
tensile strain and bending cycling. As an example, an extended-gate
organic transistor was developed as a proximity sensor to perceive
the approach of a charged object.