2021
DOI: 10.1039/d1ra04602k
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Epoxy composite with high thermal conductivity by constructing 3D-oriented carbon fiber and BN network structure

Abstract: As electronic devices tend to be integrated and high-powered, thermal conductivity is regarded as the crucial parameter of electronic components, which is the main factor that limits the operating speed and service lifetime of electronic devices.

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Cited by 15 publications
(7 citation statements)
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“…Moreover, the thermal conductivity of CF-reinforced composites with a three-dimensional oriented skeleton is also limited by inevitable gaps between adjacent fibers. 25 One of the main challenges in polymer-based composite materials is the creation of an effective three-dimensional thermal conductivity network within the polymer matrix, achieved by using low filler fractions and ensuring their homogeneous dispersion. 26 It is worth noting that, in addition to achieving a homogeneous distribution of fillers, the type of matrix and fillers-meaning the interaction between the filler and polymer-plays a crucial role in determining the thermal and mechanical properties of the composites.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, the thermal conductivity of CF-reinforced composites with a three-dimensional oriented skeleton is also limited by inevitable gaps between adjacent fibers. 25 One of the main challenges in polymer-based composite materials is the creation of an effective three-dimensional thermal conductivity network within the polymer matrix, achieved by using low filler fractions and ensuring their homogeneous dispersion. 26 It is worth noting that, in addition to achieving a homogeneous distribution of fillers, the type of matrix and fillers-meaning the interaction between the filler and polymer-plays a crucial role in determining the thermal and mechanical properties of the composites.…”
Section: Introductionmentioning
confidence: 99%
“…There are many methods to enhance the thermal conductivity of CF/EP composites, such as adding thermal conductive micro/nano fillers to polymer, 9 modifying fiber and interface 10 and constructing a 3D network thermal channel. 11 Adding thermal conductive fillers is a simple and efficient way to enhance the thermal conductivity of composite materials. 12,13 Hexagonal boron nitride (h-BN) has been widely used as the thermal conductive filler due to its high thermal conductivity, low density, good stability and cost-efficiency.…”
Section: Introductionmentioning
confidence: 99%
“…Carbon fiber/epoxy resin (CF/EP) composite laminates exhibit high strength and strong impact resistance 1–3 . They are suitable for engineering applications, such as aerospace and automotive rails 4,5 .…”
Section: Introductionmentioning
confidence: 99%
“…Carbon fiber/epoxy resin (CF/EP) composite laminates exhibit high strength and strong impact resistance. [1][2][3] They are suitable for engineering applications, such as aerospace and automotive rails. 4,5 In their service process, CF/EP composite laminates often inevitably experience various impact loadings.…”
Section: Introductionmentioning
confidence: 99%