Epoxy Die Attach Challenges in Miniature and Compact DFN / QFN Packages

Sin, Chin Lap; Eng, Tan Chee; Amiruddin, Mohd Syahril; Lee, Tan Seng

doi:10.1109/eptc.2008.4763479

2008 10th Electronics Packaging Technology Conference 2008

DOI: 10.1109/eptc.2008.4763479

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Epoxy Die Attach Challenges in Miniature and Compact DFN / QFN Packages

Chin Lap Sin¹,

Tan Chee Eng²,

Mohd Syahril Amiruddin³

et al.

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2021

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Die Attach Process Robustness through Epoxy Pattern Optimization for DFN Device

Dinglasan¹,

Gomez²

2021

JERR

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As the modern world evolves through innovation and technology, manufacturing companies of semiconductor drive their people to dedicate themselves on continuous improvement and technical advancement. Products they produce becomes smaller and thinner, but applications are limitless and innovative. In manufacturing of quad flat no lead packages, challenges were encountered during the die attach process especially in small die size. Die attach material overflow on pad is one of these, and certain parameters and techniques are explored to have a quality and robust process. Defining appropriate epoxy pattern with respect to the die size is a big factor to make sure no epoxy material will flow outside the die pad perimeter that may cause unit rejection. This paper will discuss the related issues of the said package by performing experiments and applying certain techniques to address the problem.

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Die Attach Process Robustness through Epoxy Pattern Optimization for DFN Device

Dinglasan¹,

Gomez²

2021

JERR

View full text Add to dashboard Cite

show abstract

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Epoxy Die Attach Challenges in Miniature and Compact DFN / QFN Packages

Cited by 1 publication

References 2 publications

Die Attach Process Robustness through Epoxy Pattern Optimization for DFN Device

Die Attach Process Robustness through Epoxy Pattern Optimization for DFN Device

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