2019
DOI: 10.1002/app.48326
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Epoxy/imidazolium‐based ionic liquid systems: The effect of the hardener on the curing behavior, thermal stability, and microwave absorbing properties

Abstract: A new transparent microwave absorbing coating was developed by compounding 1-butyl-3-methyl imidazolium tetrafluoroborate (bmim.BF 4 ) ionic liquid (IL) with diglycidyl ether of bisphenol A-type epoxy resin. The systems were crosslinked with the IL alone or combined with conventional hardeners, as anhydride or aromatic amine. The curing behavior was investigated by thermal and spectroscopic analysis performed at high temperatures. Neat bmim.BF 4 was able to cure epoxy resin, giving rise to networks with outsta… Show more

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Cited by 26 publications
(33 citation statements)
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“…The data summarized in Table 2 confirm that the crosslinking densities of DGEB/PAIIL 4:1 and 2:1 are the most suitable weight ratios to obtain highly crosslinked epoxy networks. These data agree with that determined from DMA (Figure 10) to confirm that DGEB/PAIIL 4:1 and 2:1 have been cured for the shortest time at the lowest temperature and indicating a relatively uniform networks [35][36][37]. It is also noticed that DGEB/PAIIL weight ratios 3:1 and 1:1 undergo more pronounced lower temperature beta transitions before going through the glass transition temperature at similar temperatures to indicate that their networks containing different structural domains (heterogeneous).…”
Section: Curing Of Dgeb Epoxy With Paiilsupporting
confidence: 89%
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“…The data summarized in Table 2 confirm that the crosslinking densities of DGEB/PAIIL 4:1 and 2:1 are the most suitable weight ratios to obtain highly crosslinked epoxy networks. These data agree with that determined from DMA (Figure 10) to confirm that DGEB/PAIIL 4:1 and 2:1 have been cured for the shortest time at the lowest temperature and indicating a relatively uniform networks [35][36][37]. It is also noticed that DGEB/PAIIL weight ratios 3:1 and 1:1 undergo more pronounced lower temperature beta transitions before going through the glass transition temperature at similar temperatures to indicate that their networks containing different structural domains (heterogeneous).…”
Section: Curing Of Dgeb Epoxy With Paiilsupporting
confidence: 89%
“…Moreover, the disappearance of the DGEB epoxy ring (Figure 7a) at 910.64 cm −1 from the spectrum of DGEB/PAIIL (Figure 7a) indicating that all epoxy ring was consumed in the reaction, which is in support of Schemes 2 and 3. The disappearance of carbonyl bands from 1700 to 1750 cm −1 attributed to de-alkylation mechanism of IIL [35][36][37] confirms that the de-protonation mechanism (Scheme 3) was preferred to cure DGEB resin with PAIIL. Thermal stability of the cured DGEB epoxy resin with different weight ratios of PAIIL (DGEB/PAIIL; 4:1, 3:1, 2:1, and 1:1) was investigated from TGA thermograms represented in Figure 8.…”
Section: Curing Of Dgeb Epoxy With Paiilsupporting
confidence: 52%
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“…1,2 Despite the excellent thermo-mechanical properties, the high crosslink density of epoxy resins makes them brittle. In recent literature, three ways to improve fracture toughness of epoxy are discussed: (1) adding hard or rubbery particles 3,4 ; (2) manipulating the chemical structure of the resin with additives and modifiers 5,6 ; or (3) by changing the curing conditions, such as temperature. 7,8 Amine-based hardeners are widely used with epoxy, where epoxy resins cured with imidazoles may have comparatively superior physicochemical properties.…”
Section: Introductionmentioning
confidence: 99%