Epoxy Resin/POSS Nanocomposites with Toughness and Thermal Stability

Abstract

To improve the mechanical property of epoxy resin (EP) had received intensive attentions in engineering industries at present. For this reason, three kinds of epoxy resin nanocomposites were prepared by incorporating different POSS nanoparticles. This study showed the toughening effect of three kind of nanocomposites and analyzed the different toughening mechanism. The thermomechanical properties and impact strength of the samples were investigated by means of dynamic thermomechanical analysis (DMA) and XJJ-50 type tester. The thermal stability was examined by thermal gravimetric analysis (TGA) and scanning electron microscopy (SEM) was used to characterize the morphology of fracture surfaces for composites. When introduction of Octavinyl-POSS (OV-POSS), DodecaPhenyl-POSS (DP-POSS) and Methacryl-POSS (M-POSS) was 1.0 phr, the values of impact strength reach 22.60 kJ/m 2 , 24.90 kJ/m 2 , 29.61 kJ/m 2 and the values of storage modulus get to 2.88 GPa, 2.25 GPa, 2.14 GPa respectively. It can be observed that M-POSS has the most obvious effect when introduced into the same amount of POSS. Meanwhile, adding nanoparticles has no obvious impact on the excellent thermal stability of EP.

Synthesis and properties of cured epoxy mixed resin systems modified by polyphenylene oxide for production of high‐frequency copper clad laminates

“…This indicates that use of different molecular weight rPPO can result in a slight increase in the T d50 % of the mixed resin systems. This may be due to the bond energies of a CO bond (364 kJ/mol) and a SiO bond (364 kJ/mol) being greater than that of a CC bond (334 kJ/mol) . Therefore, introduction of rPPO into epoxy resin can potentially improve the thermal stability of a derived epoxy resin.…”

Improving the thermal conductivity and mechanical property of epoxy composites by introducing polyhedral oligomeric silsesquioxane‐grafted graphene oxide

“…Subsequently, the 15 phr curing agent of TEOA was added and stirred to the homogeneous state after the ethanol solvent has absolutely volatilized. Finally the liquid mixture was poured into a Polytetrafluoroethylene (PTFE) mold, and then was deaerated for 10 min in a vacuum chamber and cured at 80°C for 4 h . After this curing process, the samples were removed from the mold and polished for use.…”

Silsesquioxane‐Containing Hybrid Nanomaterials: Fascinating Platforms for Advanced Applications

“…For example, phenyl‐functionalized SSQs are promising as gas separation membranes or surface coatings for electronic or optical devices owing to their excellent thermal stability and electrical insulation . Vinyl‐functionalized SSQs can be grafted or copolymerized with polymers because of the unsaturated groups on the surface . Amino‐functionalized SSQs hybrid composites show high reactivity and oxidation resistance .…”

“…Glycidyl‐POSS (GC‐POSS) are often used to improve the properties of epoxy resin . Epoxy resin usually has good adhesion and chemical resistance but the material is limited by the high viscosity, high shrinkage during the curing process, and low thermal stability . Lee's group blended different contents of a glycidyl‐POSS into an epoxy resin (diglycidyl ether of bisphenol‐A) and cured them with an amine hardener at various temperatures and times to improve the thermal properties .…”