Erosion Corrosion in Copper Water Tubing

Knutsson, L.; Mattsson, Einar; Ramberg, B-E.

doi:10.1179/000705972798322856

Cited by 32 publications

(10 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…7, the surface morphology of the uncoated copper and polypyrrole-coated copper electrode following 7 days immersion in the chloride solution are shown. The uncoated copper electrode appears covered by insoluble corrosion products of copper oxides and chlorides, most likely the sparingly-soluble atacamite (Cu 2 (OH) 3 Cl) [23]. It is well documented that the electrodissolution of copper occurs through the oxidation of Cu to Cu + , the reaction of Cu + with Cl À to generate CuCl, and the transformation of the CuCl to CuCl À 2 .…”

Section: Corrosion Protection Propertiesmentioning

confidence: 99%

See 1 more Smart Citation

Polypyrrole electrodeposited on copper from an aqueous phosphate solution: Corrosion protection properties

2007

View full text Add to dashboard Cite

Highly adherent and homogenous polypyrrole films were electrodeposited at copper from a dihydrogen phosphate solution. The polypyrrole films were electrosynthesized in the overoxidized state by cycling the copper electrode from -0.4 to 1.8 V (SCE) in a pyrrole-containing phosphate solution. The growth of the polypyrrole films was facilitated by the initial oxidation of the copper electrode in the phosphate solution to generate a mixed copper-phosphate, copper oxide or hydroxide layer. This layer was sufficiently protective to inhibit further dissolution of the copper electrode and sufficiently conductive to enable the electropolymerization of pyrrole at the interface, and the generation of an adherent polypyrrole film.Potentiodynamic polarization measurements, Tafel analyses and open-circuit potential data revealed that the polypyrrole coating effectively protects the copper substrate from corrosion in a chloride solution. However, the corrosion protection properties were reduced with longer immersion times.

show abstract

Section: Corrosion Protection Propertiesmentioning

confidence: 99%

“…The accompanying reduction reaction is the reduction of dissolved oxygen to generate hydroxyl anions. The sparingly-soluble atacamite is produced from the reaction of the hydroxyl anions and the cuprous chloride [23,24]. The micrograph in Fig.…”

Section: Corrosion Protection Propertiesmentioning

confidence: 99%

Polypyrrole electrodeposited on copper from an aqueous phosphate solution: Corrosion protection properties

2007

View full text Add to dashboard Cite

show abstract

“…This porous oxide in turn was hydrolyzed to form a top layer of atacamite as represented by Eq. 8 [31]. The formed atacamite was not protective and not compact enough to decrease the chloride ion attacks.…”

Section: Chronoamperometric Measurementsmentioning

confidence: 96%

“…At the same time, the reaction between the hydroxide group and the cuprous chloride complex could lead to a top layer of sparingly soluble atacamite (Cu 2 (OH) 3 Cl) [31],…”

Section: Weight Loss Inhibition Efficiency Sem and Eds Investigationsmentioning

confidence: 99%

Surface protection of copper in aerated 3.5% sodium chloride solutions by 3-amino-5-mercapto-1,2,4-triazole as a copper corrosion inhibitor

Sherif

Almajid

2010

J Appl Electrochem

View full text Add to dashboard Cite

Surface protection of copper in aerated 3.5% NaCl solutions by 3-amino-5-mercapto-1,2,4-triazole (AMTA) has been reported. The study has been carried out using weight loss, pH, potentiodynamic polarization (PDP), electrochemical impedance spectroscopy (EIS), and chronoamperometric (CA) measurements along with scanning electron microscopy (SEM) and energy dispersive X-ray (EDS) investigations. Weight-loss data indicated that the dissolution rate and the pH of the solution decreased to a minimum after 24 days of copper immersion due to the inhibitive action of AMTA. PDP, CA, and EIS measurements showed that AMTA decreased the corrosion rates and increased the polarization resistance and inhibition efficiency. This effect was increased with increasing AMTA concentration as well as the immersion time of the copper electrode to 50 h before measurements. SEM micrograph and EDS analysis proved that the inhibition of copper corrosion takes place due to adsorption of AMTA onto the surface. These results together confirmed that AMTA is a good mixed-type inhibitor and the inhibition of copper corrosion is achieved by strong adsorption of AMTA molecules.

show abstract

“…However, a potentiostatic investigation [17,18] at 350 mV for approximately 2 h showed that CuCl is converted into a porous layer of Cu 2 O. This Cu 2 O layer is hydrolysed to form unstable hydroxide layer that cannot prevent chloride attack and the current is therefore increased [19].…”

Section: Potentiodynamic Polarization Measurementsmentioning

confidence: 99%

Effect of alloying elements on the electrochemical behavior of Cu–Ni–Zn ternary system in sulfide-polluted saltwater

Awad

Ashour

Fouda

et al. 2014

Applied Surface Science

View full text Add to dashboard Cite

Erosion Corrosion in Copper Water Tubing

Cited by 32 publications

References 0 publications

Polypyrrole electrodeposited on copper from an aqueous phosphate solution: Corrosion protection properties

Polypyrrole electrodeposited on copper from an aqueous phosphate solution: Corrosion protection properties

Surface protection of copper in aerated 3.5% sodium chloride solutions by 3-amino-5-mercapto-1,2,4-triazole as a copper corrosion inhibitor

Effect of alloying elements on the electrochemical behavior of Cu–Ni–Zn ternary system in sulfide-polluted saltwater

Contact Info

Product

Resources

About