2016
DOI: 10.1103/physrevb.93.159902
|View full text |Cite
|
Sign up to set email alerts
|

Erratum: Sudden stress relaxation in compound semiconductor thin films triggered by secondary phase segregation [Phys. Rev. B 92, 155310 (2015)]

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
8
0

Year Published

2016
2016
2021
2021

Publication Types

Select...
2

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(8 citation statements)
references
References 0 publications
0
8
0
Order By: Relevance
“…For CIGSe the extraction of the evolution of crystal domain sizes from diffraction peak widths is not reliable due to the Ga gradient, which also influences the peak width. However, since in a similar process without Ga the width of the 112 peak decreased with decreasing PD signal and remained constant afterwards, 30,42 we conclude that the grain growth takes place during planar fault annihilation. The acceleration of the annihilation rate at the Cu-poor to Cu-rich transition can then be explained by a lowering of the activation energy for grain boundary mobility.…”
Section: Mechanism Of Planar Defect Annihilationmentioning
confidence: 68%
See 3 more Smart Citations
“…For CIGSe the extraction of the evolution of crystal domain sizes from diffraction peak widths is not reliable due to the Ga gradient, which also influences the peak width. However, since in a similar process without Ga the width of the 112 peak decreased with decreasing PD signal and remained constant afterwards, 30,42 we conclude that the grain growth takes place during planar fault annihilation. The acceleration of the annihilation rate at the Cu-poor to Cu-rich transition can then be explained by a lowering of the activation energy for grain boundary mobility.…”
Section: Mechanism Of Planar Defect Annihilationmentioning
confidence: 68%
“…Due to the shallow incidence and exit angles of the EDXRD/XRF setup (see Methods), the fluorescence signals provide time-resolved information about elemental depth distributions. 41 While the slow increase of Cu-Ka up to t E 60 min can be explained by a near homogenous incorporation of Cu into the film, the increased slope starting at the vertical dashed line reveals the onset of Cu-Se segregation at the surface of the film, 30,42 which is expected as soon as the film is Cu-saturated. 42 It can be seen that the fast drop of the PD signal starts shortly before the onset of Cu-Se segregation.…”
Section: View Article Onlinementioning
confidence: 99%
See 2 more Smart Citations
“…It is mainly because thermal energy is needed for Cu diffusion, as well as to promote grain growth and annihilate defects. [ 4–6 ] Although single‐stage low‐temperature pulsed electron deposition (LTPED) can yield the efficiencies up to 17.0% at 250 °C, [ 7,8 ] this technique presents scale‐up challenges and technical issues such as the presence of micrometer‐sized particle. [ 9 ] A simpler method offering high performance and a better potential for transferring from laboratory to manufacturing is, therefore, needed.…”
Section: Introductionmentioning
confidence: 99%