Erratum: “Thermal property measurement of solder joints fabricated by self-propagating exothermic reaction in Al/Ni multilayer film”

Thermal management of personal computer and other devices are critical issue for stable operation. Especially, soft and high thermal conductive materials are widely required for thermal transfer from heat source to heat sink. In this study, we prepared high thermal conductive composite with long single wall carbon nanotube, pitch-derived carbon fiber and fluorinated rubber. Thermal conductivity of the composites is up to 80 W mK À1 which is higher than that of iron or brass. Furthermore, origin of the high thermal conductivity of the composites is investigated by using Weidman-Franz low. Carbon nanotubes enhance phonon thermal transfer between carbon fiber to carbon fiber.

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Highly Thermally Conductive Yet Flexible Composite of Carbon Fiber, Carbon Nanotube, and Rubber Obtained by Decreasing the Thermal Resistivity at the Interface between Carbon Fiber and Carbon Nanotube

Ata

Subramaniam

Nishizawa

et al. 2016

Adv Eng Mater

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Influence of bonded area size on cracking in reacted NiAl layer for crack-free reactive soldering

Morishita

Ito

Namazu

2020

Jpn. J. Appl. Phys.

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Al/Ni multilayer film shows self-propagating exothermic reaction. By applying a small energy into the film, a NiAl intermetallic compound is formed, and simultaneously the heat generates. We use an Al/Ni exothermic film as a heat source for locally and instantly soldering Si wafers. However, cracking in the reacted NiAl layer is a big problem to be overcome in this reactive bonding technique. In this paper, we try to optimize the bonding condition without generating cracks.

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Mechanical shock-induced self-propagating exothermic reaction in Ti/Si multilayer nanofilms for low-power reactive bonding

Kuntani¹,

Goto²,

Maekawa³

et al. 2020

Jpn. J. Appl. Phys.

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In this study, we describe the development of a new solder bonding technique using a Ti/Si multilayer film, which can be conducted by mechanical shock only. A Ti/Si multilayer film is a self-propagating exothermic reactive material that can be ignited by applying both mechanical and electrical shocks (e.g. a spark in the latter case). The influence of bilayer thickness on film ignition was investigated by means of mechanical impact testing. The threshold energy for the exothermic reaction gradually decreased with decreasing bilayer thickness. We demonstrate the effectiveness of reactive solder bonding for a Si wafer by applying mechanical shock to a 25 nm bilayer thick Ti/Si film using an anisotropic wet-etched Si pyramid.

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Erratum: “Thermal property measurement of solder joints fabricated by self-propagating exothermic reaction in Al/Ni multilayer film”

Cited by 8 publications

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Highly Thermally Conductive Yet Flexible Composite of Carbon Fiber, Carbon Nanotube, and Rubber Obtained by Decreasing the Thermal Resistivity at the Interface between Carbon Fiber and Carbon Nanotube

Highly Thermally Conductive Yet Flexible Composite of Carbon Fiber, Carbon Nanotube, and Rubber Obtained by Decreasing the Thermal Resistivity at the Interface between Carbon Fiber and Carbon Nanotube

Influence of bonded area size on cracking in reacted NiAl layer for crack-free reactive soldering

Mechanical shock-induced self-propagating exothermic reaction in Ti/Si multilayer nanofilms for low-power reactive bonding

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