ESCA Analysis of PMDA-ODA Polyimide

Buchwalter, Paulin; Baise, A. I.

doi:10.1007/978-1-4615-7637-2_36

Cited by 37 publications

(5 citation statements)

References 5 publications

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“…In the C 1s spectra of PI-A-0, five distinct peaks could be deconvoluted, corresponding to the phenyl, C*–C–O, C–N, imide CO, and shakeup bonds, respectively. The N 1s spectra at 400.1 eV indicate the presence of the imide structure with a minor peak at 398.3 eV assigned to the isoimide structure . The O 1s spectra at 531.5 eV are assigned to the carbonyl oxygen within the imide structure.…”

Section: Resultsmentioning

confidence: 98%

Intrinsically UV-Resistant Copolyimide: Exploring the Impact of UV-Absorbing Groups on Degradation and Comprehensive Performance

Zhang,

Zhou,

Dong

et al. 2024

Macromolecules

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The rapid evolution of the aerospace industry has ignited an unprecedented surge in the demand for highperformance materials and their accompanying prerequisites. Polyimides (PIs), known for their outstanding comprehensive performance, have proven to be highly valuable as outer protective layers for spacecraft. However, prevailing PI materials still grapple with limitations including insufficient ultraviolet (UV) resistance, inadequate mechanical properties, suboptimal dimensional stability, and challenges in compatibility with other materials. Herein, this work fabricated new intrinsically UV-resistant PI films with greatly enhanced mechanical stability by copolymerization with a low-level introduction of ortho-hydroxybenzophenone diamine. The results show that the incorporation of UV-absorbing groups inhibits the ring-opening reactions of imide groups and promotes the formation of an inert surface during the UV degradation process. The copolyimides maintain excellent mechanical and thermal properties of the Upilex-S PI films and exhibit controllable coefficient of thermal expansion (CTE) values and surface free energy by regulating the molar ratio of diamines, which are significant factors for enhancing performance, compatibility, and durability of composite materials in diverse applications. This work endeavors to establish a relationship among chemical structure, degradation mechanism, and material performance. It provides a valuable foundation for the design of high-performance materials with enhanced UV resistance and comprehensive properties, as well as for the preparation of corresponding composite materials.

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Section: Resultsmentioning

confidence: 98%

Intrinsically UV-Resistant Copolyimide: Exploring the Impact of UV-Absorbing Groups on Degradation and Comprehensive Performance

Zhang,

Zhou,

Dong

et al. 2024

Macromolecules

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“…PMDA-ODA polyimide has been well characterized and the main features of the core-level spectra are well understood (46,47). The different ring structure (different number of carbonyl groups on the anhydride rings) between PMDA-ODA and BPDA-PDA leads to different electron charge distribution thus the shifts between the anhydride and amine rings is different in the two polyimides.…”

Section: Information From Pesmentioning

confidence: 99%

Photoelectron Spectroscopies Applied to Polymer—Metal Interactions

Kowalczyk

1990

ACS Symposium Series

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The application of photoelectron spectroscopy (PES) for the investigation of polymer-metal interfaces is discussed in this chapter. The information obtainable from both core-level spectra and valence-band spectra is briefly described. The approach of model compounds to study specific interactions is shown to be a useful aid to the understanding of polymer--metal reactivity.Emphasis is given to a number of experimental aspects relevant to polymer--metal interface studies, such as sample preparation and problems such as beam induced damage. Some of the advantages of synchrotron radiation and small spot x-ray sources are demonstrated. Most of the illustrative examples will come from polyimide-metal interface studies directed at investigating the role of interfacial chemistry in adhesion at these interfaces and the non-equivalence of polymer-on-metal and metal--on-polymer interfaces.Photoelectron spectroscopy (PES) has become an important and widely used tool in material science (1-3).It has been a particularly fruitful technique for the investigation of polymers (4-9).In this review, we will focus on the application of photoelectron spectroscopy to the investigation of the interfaces between metals and polymers. These studies are directed primarily to understand the role of interfacial chemistry in the adhesion between metals and polymers. Two aspects, which will be emphasized here, are the experimental approaches in PES studies of polymer/metal interfaces and the types of information accessible from the PES experiments.The experimental emphasis will be on preparation of appropriate samples for polymer/metal interface studies, practical problems 0097-6156/90/0440-O010$07.50A)

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“…We have interpreted the fitting results with the help of available published data. [22][23][24][25][26][27] Computed absolute binding energies (BE's) and integrated intensities of resolved C(1s), N(1s), and O(1s) for the original and basetreated Kapton samples are reported in Table VI. As can be visualized, a decrease exists in the atomic concentration of carbon bonded to other carbons or hydrogen to 284.6 eV from 49.3% to 42.8% upon comparing the original Kapton to the base-treated one.…”

Section: A Nh 4 Oh Treatment Of Kaptonாmentioning

confidence: 99%

Low-resistance films of polyimides with impregnated copper sulfide

et al. 2001

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Surface modification of polyimides has been used to obtain better interaction with an inorganic material. Copper sulfide incorporation onto the surface of commercial Kapton polyimide showed that treatment with base was necessary for adherence of the copper sulfide to the polymeric matrix. The optimized conditions for composite preparation, obtained by response surface methodology, was pH 1.4 at 80°C for 3.67 h. Using these conditions, we obtained electrical resistance as low as 1.0 ohm for CuS\Kapton composites. These optimized conditions were used to prepare other low-resistance polyimide composites. The resulting composites were analyzed by photoelectron spectroscopy. The presence of S(2p) and Cu(2p) peaks demonstrated the incorporation of copper sulfide onto the polyimide surface. Scanning electron microphotographs and the images from atomic force microscopy showed a homogeneous CuS distribution in all composites.

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ESCA Analysis of PMDA-ODA Polyimide

Cited by 37 publications

References 5 publications

Intrinsically UV-Resistant Copolyimide: Exploring the Impact of UV-Absorbing Groups on Degradation and Comprehensive Performance

Intrinsically UV-Resistant Copolyimide: Exploring the Impact of UV-Absorbing Groups on Degradation and Comprehensive Performance

Photoelectron Spectroscopies Applied to Polymer—Metal Interactions

Low-resistance films of polyimides with impregnated copper sulfide

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