1992
DOI: 10.1143/jjap.31.1597
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Etching and Optical Characteristics in GaAs/GaAlAs Surface Emitting Laser Fabrication Using a Novel Spray Etch

Abstract: We present some results on a novel spray wet etch technique and surface characterization in forming short cavity structures for GaAs/GaAlAs vertical cavity surface emitting lasers. A completely flat epitaxial surface was obtained for the output-side mirror by selectively removing the GaAs substrate. The surface reflectivity was uniform and the reproducibility was drastically improved.

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Cited by 8 publications
(5 citation statements)
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“…We also prepared a control sample without a ferromagnetic layer. Each sample was mounted on fused silica with transparent epoxy and the substrates were removed up to the 400-nm AlGaAs layer by a selective etch (14).…”
mentioning
confidence: 99%
“…We also prepared a control sample without a ferromagnetic layer. Each sample was mounted on fused silica with transparent epoxy and the substrates were removed up to the 400-nm AlGaAs layer by a selective etch (14).…”
mentioning
confidence: 99%
“…In the previous work, both pump and probe beams radiated from the back side of the sample. To avoid the loss of both pump and probe beams, the usual method was first mounting the measured sample on fused silica with transparent epoxy and then the substrates were removed up to an etching stop layer (400 nm AlGaAs layer) by a selective etch [7]. To avoid the difficulty in preparing such sample, we adopted a new measurement skill, and let both pump and probe beams radiate directly onto the front side of samples without the need for removing the thick substrate portion.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…The sample sizes used in experiments vary from less than 1 cm to full 2 wafers [22], [23]. The fusion pressure reported in the literature varies over a wide range, from relatively small pressures of 3 kPa [17], [18], 30 kPa [24], 100 kPa [25], to 3 MPa [12], [20], [22], [26]. The key factor in the effective application of the force on the samples is its uniformity.…”
Section: Wafer Fusing: Process Descriptionmentioning
confidence: 99%