Etching methodologies in &lt;111&gt;-oriented silicon wafers

Oosterbroek, R.E.; Berenschot, J.W.; Jansen, Henricus V.; Nijdam, A.J.; Pandraud, G.; Berg, Albert van den; Elwenspoek, M.

doi:10.1109/84.870065

Cited by 75 publications

(69 citation statements)

References 20 publications

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“…1d). Wet chemical etching can be either isotropic (Schwartz and Robbins 1976) or anisotropic (Bean 1978;Sugiyama et al 1986;Oosterbroek et al 2000), resulting in channel cross sections as shown in Fig. 4(1,2).…”

Section: Silicon Etching Methodsmentioning

confidence: 99%

A versatile technology platform for microfluidic handling systems, part II: channel design and technology

Groenesteijn

Boer

Lötters

et al. 2017

Microfluid Nanofluid

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integrated devices. The channels can be freely suspended, and top-side, bottom-side and in-plane fluidic interfacing is possible. Transducer structures can be integrated in close proximity to the fluid using suitable materials. In these microfluidic handling systems, many different microfluidic devices can be integrated on the same chip. As a result, these devices are connected with very small internal volumes which allows for fast response times and handling of small sample sizes. Several options are proposed to add functionality to the devices. Some examples of these are: metalization, release of the channels from the bulk or a buried oxide layer to mechanically or electrically isolate parts of the chip or provide buried fluidic channels.In this paper, we discuss several channel etching methods and look at their applicability in the platform. The full fabrication process is discussed in Groenesteijn et al. (2017). The channels are etched isotropically through etch slits in a silicon-rich silicon nitride layer on top of the wafer. As a result, the size and shape of the channels can be tuned to meet the demands of any application. Here, we propose a method, based on an empirical etch model, to design the slit pattern that will result in the desired channel shape.In Sect. 4, the channel design of an integrated microfluidic handling system with multiple fluidic sensors is discussed. Fabrication outlineThe fabrication of the devices can be roughly divided into three main steps: fabrication of the microchannels, fabrication of the functional structures and fabrication of the fluidic access to the channels. In this section, an outline of the fabrication process is given where channels are etched at Abstract Microfluidic devices often require channels of a specific size and shape. These devices are then made in a fabrication process that is often specialized to produce only those (and very similar) channels. As a result, devices requiring channels of different size and shape cannot easily be integrated on the same chip. This paper presents a method to fabricate microfluidic channels in a wide range of shape and size on the same chip by using a slit pattern through which the channels are etched. The fabrication process to fabricate these channels is discussed in detail, and an empirical model is presented to find the optimal slit pattern for a required size and shape. This part of the paper focusses on the channel design and fabrication. Details on the whole fabrication process and optional functionalization of the channels are presented in part I of this paper.

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Section: Silicon Etching Methodsmentioning

confidence: 99%

A versatile technology platform for microfluidic handling systems, part II: channel design and technology

Groenesteijn

Boer

Lötters

et al. 2017

Microfluid Nanofluid

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“…4.21 shows some possible structures that are realizable in (111) silicon. For micro fluid application, these structures are of great interests [23]. …”

Section: Bulk Micromachining Of (111) Siliconmentioning

confidence: 99%

“…At early times, this was indeed true. However, with the invention and continuous improving of Deep Reactive Ion Etching (DRIE) process, more and more (111) silicon wet etching process are developed [21][22][23][60][61]. Nowadays, (111) wafer has become one of the most useful substrate for MEMS fabrication.…”

Section: Bulk Micromachining Of (111) Siliconmentioning

confidence: 99%

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“…The pit typically forms following the anisotropic etch characteristics of crystalline silicon in hydroxide-based solutions (Oosterbroek et al, 2000;Berenschot et al, 2009). Even though (Mihalcea et al, 2000) (reprinted with permission, copyright The Electrochemical Society 2000).…”

Section: Introductionmentioning

confidence: 99%

3D Nanofabrication of fluidic components by corner lithography

Burouni¹

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Etching methodologies in <111>-oriented silicon wafers

Cited by 75 publications

References 20 publications

A versatile technology platform for microfluidic handling systems, part II: channel design and technology

A versatile technology platform for microfluidic handling systems, part II: channel design and technology

Ultrasonic Transducers

3D Nanofabrication of fluidic components by corner lithography

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