Etching Processes in Semiconductor Manufacturing

Abstract

The sections in this article are Introduction Wet Etching Dry Etching Etch Control and Metrology Equipment: Description of Hardware Wet Sinks Dry Processing Etch Hardware Barrel Etchers Plasma Etchers Reactive Ion Etchers Remote Plasma Generation: Microwave and ECR Endpoint, Diagnostic and Control Techniques Endpoint Monitors Optical Emission Spectroscopy ( OES ) Laser Interferometry Residual Gas Analysis/Mass Spectroscopy RF and Bias Voltage Diagnostic Tools/Metrology for Process Control Machine Related Metrology Process Related Measurements Control Techniques Present Control Strategy What is Needed? Possible Solutions Process Discussion: General Considerations Isolation Gate Definition Silicides Contact Etching Planarization Etch Steps Via Etching Metal Etching Etch Processing for 4 Mb DRAM Wafer Preparation 6.5.2 N‐Well P‐Well Field Implant Iso Mask Connector Mask Trench Capacitor Inter‐Polysilicon Oxide Mask Gate Mask LDD Spacer Etch Contact Etch Poly 3 Polycide Etch Contact Mask 2 Metal 1 Mask Pad Mask/Polyimide Mask Summary

Quantitative Phase-Field Modeling of Faceted Crystal Dissolution Processes

“…Thus, an in-depth understanding of this phenomenon is imperative for geoscientists and petrophysicists. Other than this, a wide range of engineering applications of dissolution can also be found in diverse scientific and commercial fields such as geochemistry (e.g., nuclear waste management, geothermal heat recovery), industrial manufacturing (e.g., etching of semiconductors), pharmaceutical , and food industries, and so on.…”