Eugenol-Containing Siloxane Synthesized Via Heterogeneous Catalytic Hydrosilylation and its Application in Preparation of Superb Viscoelastic Low Modulus Gels

Chen, Peijia; Ge, Xin; Liang, Weijie; Lv, Jianer; Zhang, Zhicong; Yin, Shuang; Li, Ciwei; Chen, You‐Peng; Liu, Weidong; Ge, Jianfang

doi:10.1007/s12633-022-02074-y

Cited by 5 publications

(2 citation statements)

References 43 publications

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“…A eugenol-synthesized crosslinker was constructed, according to the literature [ 23 ]. Double-end vinyl silicone oil (VS1000, 1000 mPa·s, 0.12 mmol/g) was provided by Ambia Specialty Silicone Co., Ltd. (Waukegan, IL, USA).…”

Section: Experiments Sectionmentioning

confidence: 99%

Silicone-Based Thermally Conductive Gel Fabrication via Hybridization of Low-Melting-Point Alloy–Hexagonal Boron Nitride–Graphene Oxide

Chen

Zhang

et al. 2023

Nanomaterials

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Thermal contact resistance between the microprocessor chip and the heat sink has long been a focus of thermal management research in electronics. Thermally conductive gel, as a thermal interface material for efficient heat transfer between high-power components and heat sinks, can effectively reduce heat accumulation in electronic components. To reduce the interface thermal resistance of thermally conductive gel, hexagonal boron nitride and graphene oxide were hybridized with a low-melting-point alloy in the presence of a surface modifier, humic acid, to obtain a hybrid filler. The results showed that at the nanoscale, the low-melting-point alloy was homogeneously composited and encapsulated in hexagonal boron nitride and graphene oxide, which reduced its melting range. When the temperature reached the melting point of the low-melting-point alloy, the hybrid powder exhibited surface wettability. The thermal conductivity of the thermally conductive gel prepared with the hybrid filler increased to 2.18 W/(m·K), while the corresponding thermal contact resistance could be as low as 0.024 °C/W. Furthermore, the thermal interface material maintained its excellent electric insulation performance, which is necessary for electronic device applications.

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Section: Experiments Sectionmentioning

confidence: 99%

Silicone-Based Thermally Conductive Gel Fabrication via Hybridization of Low-Melting-Point Alloy–Hexagonal Boron Nitride–Graphene Oxide

Chen

Zhang

et al. 2023

Nanomaterials

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“…Eugenol has many reactive sites such as allyl, methoxyl, phenolic hydroxyl, and activated aromatic hydrogens, making it a good candidate for organic and polymer synthesis. , Especially, eugenol has been converted into a number of epoxy prepolymers having one, , two, − three and more − eugenol-derived blocks. In addition, several silicon-functionalized eugenol-based epoxy thermosetting systems are formulated by incorporating eugenol-functionalized polydimethylsiloxane, , trimethylsilanized eugenol glycidyl ether, , linear siloxane-bridged eugenol diglycidyl ether, − cyclic siloxane-connected eugenol-derived polyglycidyl ethers, − MQ-functionalized eugenol-based diglycidyl ethers, , POSS-functionalized eugenol diglycidyl ethers, , etc. However, only limited reports have addressed eugenol-based phenolic resins so far.…”

Section: Introductionmentioning

confidence: 99%

Siloxane-Functionalized Eugenol-Based Novolacs: from Facile Synthesis to Their Cured Bisphenol A Epoxy Thermosets with Superb Toughness and Thermal Stability

Li,

Duan,

et al. 2024

ACS Appl. Polym. Mater.

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Conventional bisphenol A (BPA) epoxy resins suffer from intrinsic brittleness and inferior toughness after being transformed into a highly cross-linked network by a curative, and almost all epoxy curatives are from nonrenewable petrochemicals. Here, a series of siloxane-functionalized eugenol-based novolacs is synthesized and applied as the curative and toughener for a standard BPA epoxy (E54). Eugenol and 1,1,3,3-tetramethyldisiloane are connected through hydrosilylation to yield a bisphenol (2SiEU), followed by acid-catalyzed copolycondensation with paraformaldehyde (F) in acetic acid according to the varied molar ratios of F to 2SiEU (X = 0.5, 0.6, 0.7, or 0.8) to afford the novolacs (2SiEUPF-X). As X increases, the aromatic hydrogens (Ph−H) of 2SiEU substituted by carbons (Ph−C) increases with increased viscosities and molecular weights of 2SiEUPF-X. Both the hydroxyl and the methoxyl on 2SiEU moieties could activate the ortho positions on the aromatic rings to facilitate carbocation attack. 2SiEUPF-X has good thermal stability (T d5% > 330 °C) and fluidity at 100 °C (<2 Pa•s). 2SiEUPF-X is able to cross-link E54 well, and T g of the resultant 2SiEUPF-X/E54 thermosets increases from 60.5 to 73.7 °C as X increases. The thermosets exhibit superior thermal stability (T d5% > 430 °C, N 2 ), moderate tensile (47−49 MPa) and flexural (78−90 MPa) strengths, good stiffness at room temperature, and low moisture absorption in boiling water (<2%). Furthermore, the thermosets display significantly enhanced fracture toughness (K IC ), fracture energy (G IC ), and V-notched Charpy impact strength of 2.9−3.2 MPa•m 1/2 , 3.4−4.9 kJ•m −2 , and 5.6−6.5 kJ•m −2 , respectively. Altogether, 2SiEUPF-X is readily accessible and endows the cured BPA epoxy thermosets with superb toughness and thermal stability, playing a role in advancing biobased epoxy chemistry and technology.

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Synthesis of Novel Eugenol‐Containing Polysilsesquioxanes with a Flexible Spacer and Their Use for Functional Anticorrosive Coatings

Ageenkov,

Rozhkov,

Piskarev

et al. 2024

ChemistrySelect

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The destruction of various structural materials and products in aggressive atmospheric conditions demands for the development of more resistant and improved oligomers and polymers for adhesive coatings with barrier properties, which could prevent corrosion and rapid aging of metals and polymers. In this article, we demonstrate the synthesis of novel polysilsesquioxane containing a covalently bonded eugenol, being a corrosion inhibitor of natural origin. The research demonstrates the synthesis of a monomer from eugenol and MPTMS by the UV‐initiated thiol‐ene reaction. Polysilsesquioxanes were synthesized by hydrolytic and acidohydrolytic polycondensation methods. The 29Si NMR spectroscopy shows the difference in the chemical structures of the obtained products. The synthesized polysilsesquioxanes have a glass transition temperature of −6.5 °C and −7.2 °C for hydrolytic and acidohydrolytic polycondensation, respectively. At the same time, rheokinetics shows a significant difference in the curing of polysilsesquioxanes obtained by two different methods in the temperature range of 150–190 °C. So, it was shown that the product obtained by acidohydrolytic polycondensation exhibited much lower ability for the formation of cross‐linked networks. The product, obtained by hydrolytic polycondensation, exhibited good coating performance, and the obtained coatings showed high anticorrosive efficiency.

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Eugenol-Containing Siloxane Synthesized Via Heterogeneous Catalytic Hydrosilylation and its Application in Preparation of Superb Viscoelastic Low Modulus Gels

Cited by 5 publications

References 43 publications

Silicone-Based Thermally Conductive Gel Fabrication via Hybridization of Low-Melting-Point Alloy–Hexagonal Boron Nitride–Graphene Oxide

Silicone-Based Thermally Conductive Gel Fabrication via Hybridization of Low-Melting-Point Alloy–Hexagonal Boron Nitride–Graphene Oxide

Siloxane-Functionalized Eugenol-Based Novolacs: from Facile Synthesis to Their Cured Bisphenol A Epoxy Thermosets with Superb Toughness and Thermal Stability

Synthesis of Novel Eugenol‐Containing Polysilsesquioxanes with a Flexible Spacer and Their Use for Functional Anticorrosive Coatings

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