Evading the strength-ductility trade-off dilemma in steel-nickel heterostructured material by bionic crossed-lamellar structures

Laser-based bionic manufacturing

“…In general, LAM strategies for heterogeneous materials involve direct deposition, functional gradient joining, and intermediate layer joining [104]. Fabrication of crossed-lamellar structures inspired by conch shells by LDED demonstrates the feasibility of depositing multiple materials on the same deposition layer and on different deposition layers (figure 14(a)) [105]. The 'softer' and 'harder' regions of a heterogeneous material are unevenly deformed during plastic deformation.…”

异质金属激光增材制造研究及应用进展（特邀）

“…8 Heterogeneous metal joining strategies and cases. (a) Schematic diagrams of the four types of joining strategies [77] ; (b) LPBF direct joining of Cu10Sn/Ti6Al4V and its interface [19] ; (c) fingercrossed 316L/CuSn10 interfacial structure and samples formed by SLM [81] ; (d) bionic SS316L/IN625 interface structure formed by LDED [82] ; (e) Ti6Al4V/SS316 stainless steel heterometal connection through the intermediate layer Cu10Sn using SLM [79] ; (f) inconel 718/Ti64 heterometal connection through VC -Inconel 718 -Ti64 combination bonding layer using LENS [80] ; (g) martensitic stainless steel/austenitic stainless steel connection through gradient layer using LENS [78] 1002304 -11 9 Influence of process parameters on the microstructure and properties of heterogeneous metal components. (a) Variation of the relative density of LMDformed GH4169/K417G heterogeneous metal components with laser power [76] ; (b) LMD parameter optimization strategy and IN625/304L heterogeneous metal components prepared under the optimal parameters [90] ; (c) Ti6Al4V/ AlSi10Mg heterogeneous metal interfaces formed by LPBF under different process parameters [30] ; (d) NiTi/CuSn10 heterogeneous metal interfaces formed by SLM under different process parameters [12] 表 6 经典异质材料体系的最优/适配工艺参数 Table 6 Optimization/processing parameters for classical heterogeneous material diagram of the integrated highspeed imaging device of the LMD equipment and highspeed imaging pictures of the Cu deposition process [99] ; (c) LDED system with integrated monitoring and sensing device [100] ; (d) (e) schematic diagram of the insitu Xray imaging device integrated into the LPBF system and the photos of the Inconel 718/316L forming process captured under different processing parameters [101] ; (f) schematic diagram of integrated optical device for LDED systems [102] 亮点文章•特邀综述 adaptive mesh and boundary conditions for thermal analysis [103] ; (b) machine learning flowchart for SLM parameter optimization [104] ; (c) simulation of powder bed temperature distribution with different gradient IN718 components during LPBF manufacturing of IN718/Ti6Al4V [105] ; (d) simulation of deformation and stress distribution in LDED manufacturing of Cu/ SS304L [83] 表 7 异质金属激光增材制造的监测技术 Table 7 Monitoring techniques for laser additive manufacturing of heterogeneous metals with or without preheating [110] ; (d) (e) compar...…”