2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016
DOI: 10.1109/ectc.2016.45
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Evaluation and Optimization of Thermo-Mechanical Reliability of a TSV-Based 3D MEMS

Qinghua Zeng
1
,
Wei Meng
2
,
Yong Liang Guan
3
et al.
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Design and optimization of thermal-mechanical reliability of a TSV 3D Packaged Thermal Wind Sensor

Gao
1
,
Yi
2
,
Ye
3
et al. 2017
2017 18th International Conference on Electronic Packaging Technology (ICEPT)
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Design and optimization of thermal-mechanical reliability of a TSV 3D Packaged Thermal Wind Sensor

Gao
1
,
Yi
2
,
Ye
3
et al. 2017
2017 18th International Conference on Electronic Packaging Technology (ICEPT)
2
0
0
0
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Processes-based Multistep Simulation of Thermal- mechanical Reliability of a 3D-TSV MEMS

Zeng
1
,
Chen
2
,
Jin
3
2018
2018 19th International Conference on Electronic Packaging Technology (ICEPT)
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Entropy Production-Based Full-Chip Fatigue Analysis: From Theory to Mobile Applications

Wang
1
,
Samal
2
,
Lim
3
et al. 2019
IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.
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