IEEE Trans. Comp., Hybrids, Manufact. Technol.
 1978
DOI: 10.1109/tchmt.1978.1135296
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Evaluation of Adhesives for Hybrid Microcircuit Package Sealing

Kyle Perkins
1
,
James J. Licari
2
,
S. V. Caruso
3
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Cited by 7 publications
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Testing

Agajanian1
1979
Microelectronic Packaging
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Testing

Agajanian1
1979
Microelectronic Packaging
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Shields1
1984
Adhesives Handbook
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Evaluation of Silicon and Polymer substrates for fabrication of integrated microfluidic microsystems for DNA extraction and amplification

Gheorghe1,
Blionas2,
Ragoussis
3
et al. 2006
2006 International Conference of the IEEE Engineering in Medicine and Biology Society
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