2016
DOI: 10.1109/ted.2016.2522388
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Evaluation of Aerosol, Superfine Inkjet, and Photolithography Printing Techniques for Metallization of Application Specific Printed Electronic Circuits

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Cited by 29 publications
(19 citation statements)
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References 33 publications
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“…Although AJP has been shown useful in the production of fine pitch interconnects, Mashayekhi et al [46] argue that it is limited when producing tracks with lengths less than 100 μm. During a comparison of printing techniques for electronic applications, their work shows that the characteristic bulges at the end of AJP tracks coalesce and form a droplet-like deposition, effectively limiting the print resolution [46].…”
Section: Interconnectsmentioning
confidence: 99%
“…Although AJP has been shown useful in the production of fine pitch interconnects, Mashayekhi et al [46] argue that it is limited when producing tracks with lengths less than 100 μm. During a comparison of printing techniques for electronic applications, their work shows that the characteristic bulges at the end of AJP tracks coalesce and form a droplet-like deposition, effectively limiting the print resolution [46].…”
Section: Interconnectsmentioning
confidence: 99%
“…Examples are: 1) user-customizable logic paper with sea-of-transmission-gates of organic CMOS and inkjet printed interconnects [151]; 2) programmable logic circuits (PAL) for functional integrated smart plastic systems [106]; 3) print-programmable read-only memory [152]; and 4) inkjet-configurable gate arrays with high-resolution OTFTs and inkjet printed interconnecting dots [153].…”
Section: E Eda Tools and Design Kitsmentioning
confidence: 99%
“…Common contact-based printing technologies include gravure printing, offset printing, flexographic printing, micro-contact printing, and offset lithography printing. Non-contact printing techniques include screen-printing, slot-die coating, and inkjet printing [4,5,6]. …”
Section: Introductionmentioning
confidence: 99%