Evaluation of alternative environment-friendly buffers for Ni–B alloy electroplating

Cheng, An-Yu; Sheu, Hung‐Hua; Huang, Po-Hsiang; Liu, Yih-Ming; Pu, Nen-Wen; Ger, Ming-Der

doi:10.1016/j.jmrt.2022.09.050

Cited by 4 publications

(3 citation statements)

References 61 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…As a result, the supply of Ni 2+ was obstructed to some extent, and the reduction energy of Ni 2+ was increased, which led to a raise in cathodic overpotential (η c ). Then the higher nucleation rate (N) was also achieved by an increased polarization overpotential (η c ), as illustrated by equation (2).…”

Section: Effect Of Re Compounds On the Deposition Mechanisms Of Ni Filmsmentioning

confidence: 99%

“…Since the 1990s, Ni films have provided competitive alternative structural materials for many industries, including petrochemicals, automobiles, electronics, aerospace, etc, and electrodeposition has become the preferred preparation technology because of its simplicity, convenient implementation, low cost, and mass production [1][2][3][4]. However, the severe hydrogen evolution involved in electrodeposition procedures easily resulted in structural imperfections, peeling, or even hydrogen embrittlement for deposits [5][6][7], which left plenty of improvement room for Nielectroplating film.…”

Section: Introductionmentioning

confidence: 99%

“…To overcome this issue, numerous researchers have explored co-depositing the Ni-matrix with other metals [1,2,8] or introducing suspended insoluble second-phase particles [6,[9][10][11]. Among these, rare-Earth (RE) with low electronegativity, high activity, and chemical affinity has broad industrial prospects and is gaining importance in electrodeposition applications [12].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Effect of rare–earth (Ce, La) compounds on the microstructure, mechanical and electrochemical corrosion characteristics of electroplated Ni films

Chen

Wang

2023

Surf. Topogr.: Metrol. Prop.

View full text Add to dashboard Cite

For optimizing the microstructure and performance of Ni–electroplating film, the soluble rare–earth (RE) compounds CeCl3 or LaCl3 were introduced, which were electrodeposited on Cu substrate by direct current (DC) and pulse current (PC) methods, respectively. The surface characteristics of morphology, composition, and phase of obtained different deposits were investigated, and the relationship between the structure and the performance of internal stress, hardness, and electrochemical responses was discussed. The results show that both RE compounds were conducive to eliminating the surface pits by inhibiting the hydrogen evolution reaction, while did not co–deposit into the Ni film. Moreover, the preferred orientation of Ni (111) crystalline plane was altered into Ni (200) by LaCl3, and its combination with PC–electrodeposition further had a better grain refinement effect than CeCl3. Due to the formation of a relatively dense and fine deposit, the PC–electrodeposited Ni/LaCl3 film exhibited the highest hardness of 320 HV, lowest tensile stress of 55 MPa, and best electrochemical passivation protection, which effectively improved the comprehensive performance of Ni film and demonstrated a good prospect for industrial applications.

show abstract

Section: Effect Of Re Compounds On the Deposition Mechanisms Of Ni Filmsmentioning

confidence: 99%