Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

Schirmer, Julian; Hümmer, Michael; Klauß, Matthias; Neermann, Simone; Reichenberger, Marcus; Franke, Jörg

doi:10.1088/2058-8585/ac1fd5

Cited by 2 publications

(3 citation statements)

References 18 publications

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“…In this study, both ZIF and non-ZIF for the three-level connections (connections made with other external devices [ 47 ]) were used in the device. The non-ZIF connector was used for less changeable connections, such as power, while the ZIF connector was more versatile for data transmission, powering, and programming the MCU, as shown in Figure 6 E. The fabricated devices showed a working performance almost similar to that of the conventional devices.…”

Section: Resultsmentioning

confidence: 99%

“…According to the microstructure, the connections between the layers, between the solder bump and the top, were constructed well without any substrate damage. In this study, both ZIF and non-ZIF for the three-level connections (connections made with other external devices [47]) were used in the device. The non-ZIF connector was used for less changeable connections, such as power, while the ZIF connector was more versatile for data transmission, powering, and programming the MCU, as shown in Figure 6E.…”

Section: Device Fabrication Resultsmentioning

confidence: 99%

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Hybrid Device Fabrication Using Roll-to-Roll Printing for Personal Environmental Monitoring

et al. 2023

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Roll-to-roll (R2R) printing methods are well known as additive, cost-effective, and ecologically friendly mass-production methods for processing functional materials and fabricating devices. However, implementing R2R printing to fabricate sophisticated devices is challenging because of the efficiency of material processing, the alignment, and the vulnerability of the polymeric substrate during printing. Therefore, this study proposes the fabrication process of a hybrid device to solve the problems. The device was created so that four layers, composed of polymer insulating layers and conductive circuit layers, are entirely screen-printed layer by layer onto a roll of polyethylene terephthalate (PET) film to produce the circuit. Registration control methods were presented to deal with the PET substrate during printing, and then solid-state components and sensors were assembled and soldered to the printed circuits of the completed devices. In this way, the quality of the devices could be ensured, and the devices could be massively used for specific purposes. Specifically, a hybrid device for personal environmental monitoring was fabricated in this study. The importance of environmental challenges to human welfare and sustainable development is growing. As a result, environmental monitoring is essential to protect public health and serve as a basis for policymaking. In addition to the fabrication of the monitoring devices, a whole monitoring system was also developed to collect and process the data. Here, the monitored data from the fabricated device were personally collected via a mobile phone and uploaded to a cloud server for additional processing. The information could then be utilized for local or global monitoring purposes, moving one step toward creating tools for big data analysis and forecasting. The successful deployment of this system could be a foundation for creating and developing systems for other prospective uses.

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Section: Resultsmentioning

confidence: 99%

Section: Device Fabrication Resultsmentioning

confidence: 99%

Hybrid Device Fabrication Using Roll-to-Roll Printing for Personal Environmental Monitoring

et al. 2023

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“…Some research findings have already been published in this context. At level 3, aspects of detachable joining technologies are being investigated [19], as like as crimping [20,21] and conductive bonding interconnections [22,23]. However, to connect multiple boards, to form a functional unit, it is essential that discrete components can be reliably connected with a circuit on a substrate at level 2, first.…”

Section: Background and Motivationmentioning

confidence: 99%

Mechanical characterization of solder interconnections on functionalized, copper-containing polymer thick-film pastes for hybrid integration

Hümmer

Roudenko

Wenger

et al. 2022

Flex. Print. Electron.

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In this work, on different substrate materials thermally cured polymer thick-film pastes are connected to Surface Mount Technology resistors using a SnBiAg solder alloy. The effect of substrate pre-treatment with atmospheric plasma and thermal cycling on the shear strength of these interconnection is investigated, and the shear forces obtained are graded using MIL-STD 883. In particular, the build-up of solder interconnections on conductive structures made of commercially available copper-containing polymer thick-film pastes and their mechanical characterization is novel. As well as the mechanical characterization of conductive structures, made of polymer thick-film, on plasma-treated substrates and their grading using the MIL-STD 883. In addition, interconnections with silver-containing conductive structures are realized for comparison. Depending on the interconnection system, component mean shear forces of up to 31 N are achieved. While some systems meet the 1.25 x criterion of MIL-STD 883, the majority of the systems investigated do not meet the 1.00 x criterion. Hereby, the adhesion between the conductive structure and the substrate usually fails. Plasma pre-treatment shows an adhesion-increasing effect only for a proportion of substrate materials used, as does thermal aging. Thermal loads can also impair the adhesive strength.

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Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

Cited by 2 publications

References 18 publications

Hybrid Device Fabrication Using Roll-to-Roll Printing for Personal Environmental Monitoring

Hybrid Device Fabrication Using Roll-to-Roll Printing for Personal Environmental Monitoring

Mechanical characterization of solder interconnections on functionalized, copper-containing polymer thick-film pastes for hybrid integration

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