2021 14th International Congress Molded Interconnect Devices (MID) 2021
DOI: 10.1109/mid50463.2021.9361628
|View full text |Cite
|
Sign up to set email alerts
|

Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
17
0

Year Published

2022
2022
2023
2023

Publication Types

Select...
4
1

Relationship

0
5

Authors

Journals

citations
Cited by 11 publications
(17 citation statements)
references
References 4 publications
0
17
0
Order By: Relevance
“…The first step in brownfield development is enhancing the data acquisition from dated equipment that often has varying degrees of instrumentation and automation and can be categorized by deploying the additional sensors in the first level of the IoT reference model. Legacy machines lack ways to monitor their processing parameters [22]; fortunately, sensor technologies nowadays are well-advanced for that purpose [53]. In many cases, additional actuators are added to enhance the automation at the field level and replace the human manipulation [54].…”
Section: Enabling Technologies -Existing Solutions For Retrofittingmentioning
confidence: 99%
See 4 more Smart Citations
“…The first step in brownfield development is enhancing the data acquisition from dated equipment that often has varying degrees of instrumentation and automation and can be categorized by deploying the additional sensors in the first level of the IoT reference model. Legacy machines lack ways to monitor their processing parameters [22]; fortunately, sensor technologies nowadays are well-advanced for that purpose [53]. In many cases, additional actuators are added to enhance the automation at the field level and replace the human manipulation [54].…”
Section: Enabling Technologies -Existing Solutions For Retrofittingmentioning
confidence: 99%
“…There is an evaluation of alternative manufacturing methods for 3D Mechatronics Integrated Devices (MID) sensors for retrofitting purposes mentioned in Ref. [53]. With this ongoing interest, retrofittingpurpose sensors will be available on the shelf in the close future.…”
Section: ) Sensors Deploymentmentioning
confidence: 99%
See 3 more Smart Citations