2018 20th International Conference on Electronic Materials and Packaging (EMAP) 2018
DOI: 10.1109/emap.2018.8660763
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Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

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Cited by 2 publications
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“…The DIC system used in this study is a Dantec Q400 (Dantec Dynamics) and the associated software Instra 4D. This system has been implemented in many studies for solid material deformation measurement (Mrówka et al 2021;Gschwandl et al 2019;Techens et al 2020;Yan et al 2019). As is shown in Fig.…”
Section: Measurement Apparatusmentioning
confidence: 99%
“…The DIC system used in this study is a Dantec Q400 (Dantec Dynamics) and the associated software Instra 4D. This system has been implemented in many studies for solid material deformation measurement (Mrówka et al 2021;Gschwandl et al 2019;Techens et al 2020;Yan et al 2019). As is shown in Fig.…”
Section: Measurement Apparatusmentioning
confidence: 99%