Evaluation of electrical material properties: Embedment stress testing on electrical encapsulation resins

Melick, D.; Browning, D.; Shelton, K. P.

doi:10.1109/eeic.1993.631302

Cited by 1 publication

(3 citation statements)

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“…A test is proposed to study this impulsive failure factor where cured resins samples are subjected to a wide range of temperatures. The embedment pressure is calculated; this study shows that the embedment pressure is higher for lower temperatures [128].…”

Section: Electrical Encapsulation Materialsmentioning

confidence: 82%

“…Electrical encapsulation materials are required to properly operate transformers, motor coils, sensors, and solenoids [127]. Among the first electrical encapsulation materials were the resins, which had many advantages for protecting encapsulated electrical components [128], such as high insulation, low relative permittivity, low cost, and easy synthesis [129]. Thermoplastic resins have shown a better performance than thermosets by requiring thinner walls for them to be stronger than thermosets [127].…”

Section: Electrical Encapsulation Materialsmentioning

confidence: 99%

“…In addition, thermoplastics are produced in faster cycles, generate lesser scrap, and lack the environmental issues related to thermosets [127]. Nevertheless, when submitted to specific temperatures, resins' behavior could cause shrinkage or expansion of the material, generating focused stress and leading to premature failure [128]. A test is proposed to study this impulsive failure factor where cured resins samples are subjected to a wide range of temperatures.…”

Section: Electrical Encapsulation Materialsmentioning

confidence: 99%

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Application and Suitability of Polymeric Materials as Insulators in Electrical Equipment

et al. 2021

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In this paper, the applications of thermoplastic, thermoset polymers, and a brief description of the functions of each subsystem are reviewed. The synthetic route and characteristics of polymeric materials are presented. The mechanical properties of polymers such as impact behavior, tensile test, bending test, and thermal properties like mold stress-relief distortion, generic thermal indices, relative thermal capability, and relative thermal index are mentioned. Furthermore, this paper covers the electrical behavior of polymers, mainly their dielectric strength. Different techniques for evaluating polymers’ suitability applied for electrical insulation are covered, such as partial discharge and high current arc resistance to ignition. The polymeric materials and processes used for manufacturing cables at different voltage ranges are described, and their applications to high voltage DC systems (HVDC) are discussed. The evolution and limitations of polymeric materials for electrical application and their advantages and future trends are mentioned. However, to reduce the high cost of filler networks and improve their technical properties, new techniques need to be developed. To overcome limitations associated with the accuracy of the techniques used for quantifying residual stresses in polymers, new techniques such as indentation are used with higher force at the stressed location.

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Section: Electrical Encapsulation Materialsmentioning

confidence: 82%